Hardware Engineer, Payload Systems & Phased Arrays

Amazon; Redmond (WA); On-site; USD 136,000 - 184,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

RSUs (restricted stock units)

Job summary

Amazon LEO is seeking a Hardware Engineer to work on innovative phased array antenna systems. You will own PCBA development from concept through production and collaborate with operations, supply chain, and reliability teams to optimize design and enable manufacturing.

The role focuses on designing high‑speed digital circuitry, leading schematic capture and PCB layout, engaging vendors for DFM, and building automated test systems to validate modules before production.

Qualifications

• Bachelor's degree in electrical engineering or equivalent.
• 4+ years of industry experience in mixed signal PCBA design.
• 3+ years of experience in using schematic tools (Mentor Graphics Xpedition, Cadence OrCad, or Altium Designer).
• 1+ years of experience in high-speed digital design (SERDES, Ethernet, PCIe, etc.).

Responsibilities

• Own PCBA development from concept through production.
• Design and optimize different blocks of electronics sub-systems.
• Design high-speed digital circuitry in collaboration with various teams.
• Lead and review schematic capture and PCB layout.
• Lead PCB vendor engagement for DFM review.
• Optimize PCB stack-up for performance and cost.
• Generate test plans/procedures based on high level requirements.
• Complete board bring-up and perform test campaigns for modules and subsystems.
• Design automated test systems and fixtures for factory testing.
• Support the transition of designs to production.

Skills

Mixed signal PCBA design

High-speed digital design

Education

Bachelor's degree in electrical engineering

Tools

Mentor Graphics Xpedition

Cadence OrCAD

Altium Designer

Job description

Amazon LEO is seeking a Hardware Engineer to work on innovative phased array antenna systems. You will own PCBA development from concept through production and collaborate with operations, supply chain, and reliability teams to optimize design and enable manufacturing.

The role focuses on designing high‑speed digital circuitry, leading schematic capture and PCB layout, engaging vendors for DFM, and building automated test systems to validate modules before production.