Graduate Engineer: High-Speed SI/PI & EMC

StudySmarter

San Jose (CA)

On-site

USD 92,000 - 118,000

Full time

14 days+
Application generator

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Job summary

Infineon Technologies Americas Corp. in the United States seeks a role focusing on high-speed SI/PI and EMC for automotive Ethernet products. You will conduct EMC measurements, run simulations, and develop models to drive design sign-off.

Collaborate with IC teams to define EMC specs, build PCB/package stack-ups, and use HFSS/ADS, VNA, TDR, and high-speed oscilloscopes. A background in high-speed digital systems and strong communication completes the profile.

Qualifications

  • 1+ year of work experience in high-speed SI/PI and EMC-related fields.
  • Major in high-speed SI/PI, EMC, or a related discipline.
  • Experience with HFSS and ADS for simulations.
  • Familiarity with VNA, TDR, and high-speed oscilloscopes.

Responsibilities

  • EMC testing: Conduct EMC measurements and analysis for automotive Ethernet products.
  • Simulation: Perform signal integrity and power integrity simulations for high-speed PCBs and packages.
  • Modeling: Develop and maintain channel and device models (S-parameters, IBIS-AMI) for high-speed interfaces.
  • Correlation: Correlate simulations with measurements using VNA, TDR, and spectrum analyzers.
  • Sign-off: Review and drive SI/PI sign-off for internal high-speed PCB designs.
  • Design: Define PCB and package stack-ups, material selection, and design guidelines.
  • Collaboration: Partner with IC design teams to define EMC specifications for new products.

Skills

EMC Testing
Simulation
Modeling
Correlation
Sign-off
PCB Design
Collaboration
Python
MATLAB

Education

High-speed SI/PI
EMC

Tools

Ansys HFSS
Keysight ADS

Job description

Infineon Technologies Americas Corp. in the United States seeks a role focusing on high-speed SI/PI and EMC for automotive Ethernet products. You will conduct EMC measurements, run simulations, and develop models to drive design sign-off.

Collaborate with IC teams to define EMC specs, build PCB/package stack-ups, and use HFSS/ADS, VNA, TDR, and high-speed oscilloscopes. A background in high-speed digital systems and strong communication completes the profile.

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