Global AI Interconnect Product Lead

TE Connectivity Ltd.; United States; On-site; USD 109,300 - 164,000; Full time

Benefits offered by this job

Health insurance

401(k)

Disability insurance

Life insurance

Employee stock purchase plan

Paid time off

Job summary

TE Connectivity seeks a Global Product Manager for board mount and cable backplane solutions, driving strategy and capacity plans for a high‑growth AI segment. You will act as a mini general manager, interfacing with engineering, marketing, and sales to execute ambitious growth plans.

Ideal candidates have 5+ years in PM/Sales/Biz Dev, a strong technical literacy in signal integrity and system architecture, and a track record of rapid execution without a playbook.

Qualifications

• A 4‑year degree is desirable, or relevant experience.
• Experience: 5+ years in PM, Sales, or Biz Dev. Experience in high‑speed interconnects or AI infrastructure is strongly preferred.

Responsibilities

• Drive strategy and capacity planning for AI growth within TE Connectivity.
• Lead product launches and develop value propositions that solve customer pain points in AI interconnects.
• Own the P&L for the portfolio and manage growth and margins.
• Engage with AI customers and hyperscalers to capture the voice of the customer.
• Collaborate with S&OP to expand capacity to meet deployment cycles.

Skills

Product Management

Sales / BizDev

AI infrastructure

Cross-functional leadership

Education

4-year degree or equivalent experience

Job description

TE Connectivity seeks a Global Product Manager for board mount and cable backplane solutions, driving strategy and capacity plans for a high‑growth AI segment. You will act as a mini general manager, interfacing with engineering, marketing, and sales to execute ambitious growth plans.

Ideal candidates have 5+ years in PM/Sales/Biz Dev, a strong technical literacy in signal integrity and system architecture, and a track record of rapid execution without a playbook.