FBAR Filter Design Lead for 5G/RFFE Modules

Socket.dev; Wayne, California (CA, MO); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(k) with company match

Employee Stock Purchase Program (ESPP)

Job summary

Broadcom is seeking an FBAR Filter Designer to lead the development of high-performance RF Front-End solutions. You will own the design lifecycle from acoustic resonator synthesis to full module integration, bridging die-level physics and system-level hardware for 5G and Wi-Fi standards.

Responsibilities include designing high-Q FBAR filters, coordinating die layout, and performing 3D EM simulations to predict parasitics and ensure robust HVM performance across manufacturing corners.

Qualifications

• PhD in EE/Physics or Master’s with extensive RF/Microwave experience in acoustic filters or RF Front-End modules.
• Proven tape-outs or high-volume product releases.

Responsibilities

• Design high-Q FBAR filters and multiplexers with optimized topologies.
• Own physical die layout and package integration, optimizing parasitics and thermal dissipation.
• Manage interface between acoustic die, laminate, and PCB to ensure signal integrity and target performance.
• Lead 3D EM simulations to model package-level parasitics, interconnects, and coupling.
• Perform Monte Carlo and corner analyses to ensure robust HVM performance.
• Collaborate with process, modeling, test, module, and other design teams to correlate simulations with lab data.

Education

PhD in EE/Physics

Master's in RF/Microwave

Tools

ADS

HFSS

CST

Sonnet

Job description

Broadcom is seeking an FBAR Filter Designer to lead the development of high-performance RF Front-End solutions. You will own the design lifecycle from acoustic resonator synthesis to full module integration, bridging die-level physics and system-level hardware for 5G and Wi-Fi standards.

Responsibilities include designing high-Q FBAR filters, coordinating die layout, and performing 3D EM simulations to predict parasitics and ensure robust HVM performance across manufacturing corners.