Fabrication Backend Process Engineer, Quantum AI

Socket.dev; Goleta (CA); On-site; USD 108,000 - 153,000; Full time

Job summary

Google Quantum AI is seeking a fabrication backend process engineer to drive die singulation, cleaning, and hybridization while shaping device characterization for scalable quantum processor production.

You will collaborate with cross-functional teams to optimize device performance, yield, and reliability, and help qualify equipment and processes for advanced packaging techniques.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or equivalent practical experience.
• 1 year of experience in a wafer level or die level cleanroom environment.
• 1 year of experience with SPC, Electrical test, Metrologies (SEM, XPS, Interferometry) or Failure analysis.
• 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.
• Preferred: Master’s or PhD in EE/CE/Physics or related field, and experience with novel bump materials and robust bonding solutions.

Responsibilities

• Partner with design, test, frontend, packaging to integrate backend modules and refine probing, packaging, and measurement methodologies.
• Lead sustainment and development of die singulation, die preparation, device hybridization, and device characterization modules.
• Operate and maintain equipment to ensure optimal process outcomes and minimize downtime.
• Design, build, and maintain backend process infrastructure and implement standardized work practices.
• Analyze process data to identify trends, improve stability, and drive yield improvement.

Skills

Cleanroom experience

Hybridization techniques

Die handling

Data analysis

Education

Bachelor’s degree: EE/CE/CS/Physics or equivalent

Master’s degree or PhD in related field

Tools

SEM

XPS

Interferometry

Probing equipment

Bonding equipment

Job description

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
• 1 year of experience in a wafer level or die level cleanroom environment.
• 1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
• 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
• Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing robust structural bonding solutions.
• Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry.
• Experience with statistical process control and failure analysis activities.
• Experience with data analysis and visualization tools such as JMP, Python, or SQL.

About the job:

As a fabrication backend process engineer you will play a role in the development and manufacturing of our cutting-edge quantum processor devices. You will be responsible for the die singulation process, die cleaning process, hybridization process, and device characterization modules. Your expertise will be crucial in developing robust, scalable bonding processes and die preparation processes that meet the quality standards. You will collaborate closely with cross-functional teams, including design, test, integration and frontend engineers, to optimize device performance, yield, and reliability. Additionally, you will play a key role in the qualification of equipment and processes to establish and maintain a state-of-the-art advanced packaging technique.

The full potential of quantum computing will be unlocked with a large‑scale computer capable of complex, error‑corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $108000 - $153000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities:

• Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction.
• Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.