Equipment Engineer, Texas Institute for Electronics

The University of Texas at Austin; Minneapolis (MN); On-site; USD 125,000 - 150,000; Full time

Job summary

A leading research university in Austin is hiring an Equipment Engineer to oversee semiconductor manufacturing equipment. In this role, you'll manage the installation and maintenance of critical equipment, and collaborate with technical teams to enhance production efficiency. Candidates should hold a relevant engineering degree and have at least three years' experience in a semiconductor facility. The position offers a salary starting at $90,000, benefits, and a dynamic working environment.

Benefits

100% employee health benefits

Generous paid vacation

Tuition assistance

Professional training opportunities

Retirement plans with employer matching

Qualifications

• Three years of engineering experience in a semiconductor fab.
• Ability to work under pressure and adapt to change.
• Must possess excellent written skills.

Responsibilities

• Manage the installation of equipment.
• Create maintenance checklists and schedules.
• Drive tool selections and procurement.

Skills

Independent work

Interpersonal communication

Statistical Process Control

Project Management

Education

Bachelor’s degree in an engineering discipline

Job description

Job Posting Title: Equipment Engineer, Texas Institute for Electronics

Hiring Department: Texas Institute for Electronics

Position Open To: All Applicants

Weekly Scheduled Hours: 40

FLSA Status: To Be Determined at Offer

Earliest Start Date: Ongoing

Position Duration: Expected to Continue

Location: PICKLE RESEARCH CAMPUS

Job Details: General Notes Must be eligible to work in the United States on a full-time basis for any employer without sponsorship.

About Us The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city’s innovative spirit.

UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Purpose

This position’s primary function is to ensure the overall equipment effectiveness of semiconductor and packaging process equipment in our fabs. We are filling positions for equipment engineers in these functional equipment areas: lithography, high-vacuum plasma, wet processing, mechanical processing, and metrology and inspection. Equipment engineers will be responsible for equipment installation, the creation of equipment maintenance procedures and schedules, parts-and-kit selection-or-creation. Equipment engineers will work closely with process tool owners and integration engineers to ensure we are driving fast cycles of learning in semiconductor advanced packaging.

Each equipment engineer will be responsible for one of these functional groups of equipment. TIE is filling one position per functional area.

• Lithography: Coat tracks, Steppers, Litho-specific metrology
• High-Vacuum Plasma: CVD, Etch, Plasma Dicing, PVD
• Wet Processing: Batch cleaning, single wafer cleaning, plating.
• Mechanical Processes: CMP, Grinding, Dicing, Bonding.
• Metrology and Inspection: SEM, Defect Inspection, Film Thickness, Microscopes

Responsibilities

Manage the installation of equipment as follows:

• Drive and approve installation packages
• Manage MEP schedule and installation
• Ensure safety compliance
• Managing acquisition and installation of pedestals, VMBs, LDS, process piping, exhaust, drains and
• Oversee subcontractors.

Create and maintain the following for the equipment in your functional area:

• Equipment Specifications
• SPC Charts, including reacting to trends
• Technician Training Plans
• Maintenance Checklists and Schedules
• Process Kits
• Equipment Dashboards, and OEE Analysis Reports

Participate in or Drive Tool Selections, Equipment Procurement, Upgrade Planning, Parts Management. Perform other related functions as assigned.

Required Qualifications

• Bachelor’s degree in an engineering discipline, such as electrical, chemical, or mechanical, or similar related technical field.
• Three years of engineering experience in a semiconductor fab or semiconductor advanced packaging facility.
• Equipment Installation Project Management
• Statistical Process Control experience
• Must have the ability to work independently and have excellent interpersonal communication and written skills.
• Dependable, stable under pressure and can easily adapt to change.

Preferred Qualifications

• Five or more years of Semiconductor Equipment Engineering
• Master’s Degree or higher

Salary Range

$90,000 + depending on qualifications

Working Conditions

• Job duties may be performed in a clean room environment, in awkward positions and/ or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds may be required.
• May require bending/stooping/crawling/climbing and use of PPE.
• May work around chemical fumes
• May work around biohazards
• May work around chemicals
• May work around electrical and mechanical hazards
• May be required to work in confined spaces, tunnels, on elevated platforms

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of Interest

Equal Opportunity Employer

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.