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Northrop Grumman is seeking an Engineer/Principal Engineer RF Microwave Mixed Signal Design in Baltimore, MD. The role focuses on RF/microwave design for assemblies and subsystems, including testing, modeling, and integration within an AESA radar context.
Onsite full-time with a 9/80 schedule. Relocation assistance may be available and a Interim Secret clearance is required to start.
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies.
We are looking for you to join our team as an Engineer/Principal Engineer RF Microwave Mixed Signal Design based out of Baltimore (Linthicum), MD. This is full time onsite position that offers the 9/80 Schedule.
The Airborne Multifunction Sensors (AMS) Engineering and Sciences (E & S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.
We are seeking engineers with experience and interest in electronic assembly and packaging design. Roles and responsibilities include, but are not limited to, the following:
This requisition can be filled at either the Engineer (T02) or Principal Engineer (T03) level based on the below requirements.