Eng., Sr. Electronic Packaging

Moog; Santa Barbara (CA); Hybrid; USD 135,000 - 165,000; Full time

Job summary

Moog in Santa Barbara, CA is seeking a Senior Mechanical Packaging Engineer to design ruggedized electronics packaging for defense products used in military ground vehicle applications. You will analyze thermal and mechanical performance, create 3D CAD models, and drive production release from concept to qualification.

The role requires a Bachelor’s in mechanical engineering, 5+ years of experience in mechanical design, strong SolidWorks and ANSYS skills, and a collaborative, cross-functional

Qualifications

• Bachelor’s degree in mechanical engineering from an accredited institution.
• 5+ years of experience in mechanical design and analysis of complex systems.
• Experience with electronics packaging or mechanical design for electronic hardware.
• Proficiency with SolidWorks for 3D part and assembly modeling.
• Experience with ANSYS for structural and thermal analysis.
• Understanding of shock, vibration, and thermal design considerations for electronic assemblies.
• Experience working with PCBs, enclosures, connectors, and interconnects.

Responsibilities

• Design and develop ruggedized electronics packaging for defense products used in military ground vehicle applications.
• Analyze the structural and thermal performance of electronic systems, enclosures, and assemblies.
• Create and review 3D CAD models, assembly drawings, and interface/control documentation.
• Support product development from concept through qualification and production release.
• Help define packaging approaches for shock, vibration, thermal, and environmental requirements.
• Work closely with electrical, mechanical, manufacturing, and program teams to deliver practical, manufacturable designs.
• Prepare and review engineering data related to thermal, vibration, and tolerance performance.
• Support prototype builds, testing, troubleshooting, and design refinement.
• Participate in technical reviews and help drive solutions that meet cost, schedule, and performance goals.
• Contribute as a mechanical packaging subject matter resource during proposal and development efforts.

Skills

5+ years mechanical design experience

SolidWorks proficiency

FEA (ANSYS) experience

GD&T knowledge

Cross-functional collaboration

Education

Bachelor’s degree in mechanical engineering

Tools

ANSYS

Job description

Moog is a performance culture that empowers people to achieve great things. Our people enjoy solving interesting technical challenges in a culture where everyone trusts each other to do the right thing. For you, working with us can mean deeper job satisfaction, better rewards, and a great quality of life inside and outside of work.

Reporting To: Head, Engrg. Sect. Work Schedule: Onsite – Santa Barbara, CA

Responsibilities

• Design and develop ruggedized electronics packaging for defense products used in military ground vehicle applications
• Analyze the structural and thermal performance of electronic systems, enclosures, and assemblies
• Create and review 3D CAD models, assembly drawings, and interface/control documentation
• Support product development from concept through qualification and production release
• Help define packaging approaches for shock, vibration, thermal, and environmental requirements
• Work closely with electrical, mechanical, manufacturing, and program teams to deliver practical, manufacturable designs
• Prepare and review engineering data related to thermal, vibration, and tolerance performance
• Support prototype builds, testing, troubleshooting, and design refinement
• Participate in technical reviews and help drive solutions that meet cost, schedule, and performance goals
• Contribute as a mechanical packaging subject matter resource during proposal and development efforts

Qualifications

• Bachelor’s degree in mechanical engineering from an accredited institution
• 5+ years of experience in mechanical design and analysis of complex systems
• Experience with electronics packaging or mechanical design for electronic hardware
• Proficiency with SolidWorks for 3D part and assembly modeling preferred
• Experience with FEA tools such as ANSYS for structural and thermal analysis
• Understanding of shock, vibration, and thermal design considerations for electronic assemblies
• Experience working with PCBs, enclosures, connectors, and interconnects
• Working knowledge of GD&T and engineering drawing standards
• Familiarity with tolerance stack-up analysis
• Ability to interpret customer requirements, specifications, and applicable industry/defense standards
• Strong collaboration and communication skills in a cross-functional engineering environment

Benefits

• Other rewards may include annual bonuses, employee stock purchase plan, an open paid time off policy, and many region-specific benefits.

Moog offers an inclusive workplace, and, as such, affirms the right of every person to participate in all aspects of employment based on merit without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, age, veteran status, disability, genetic information, or any other protected characteristic.

This position requires access to U.S. export-controlled information.

Salary Range Transparency: Santa Barbara, CA $135,000.00–$165,000.00 Annually

Salary Range Disclaimer The base salary range represents the low and high end of the Moog salary range for this position in the given work location. Actual salaries will vary depending on factors including but not limited to location, experience, and performance. The range(s) listed is just one component of Moog's total compensation package for employees.