Embedded Software Engineer — FPGA/MPSoC, NEON Optimized

Robotics Technologies LLC; Milpitas (CA); On-site; USD 124,000 - 207,000; Full time

Job summary

Robotics Technologies LLC in Milpitas, CA seeks an expert Embedded Software / Firmware Contractor to design and optimize high-throughput multi-threaded software for embedded Linux on Xilinx MPSoC/RFSoC platforms, interfacing with hardware IP blocks in FPGA.

You will accelerate workloads with ARM NEON, implement robust Linux drivers (UIO, AXI DMA), and deliver production-grade code with full documentation and hand-off materials.

Qualifications

• Expert-level C for embedded Linux environments.
• Vectorize and optimize with ARM NEON intrinsics/assembly.
• Demonstrated Xilinx Zynq UltraScale+ MPSoC/RFSoC platforms (PetaLinux).
• Deep understanding of AXI4, PCIe, AXI DMA engines and Linux memory management.
• Multi-threaded programming with real-time POSIX scheduling.
• GCC/Clang cross-compilation, GDB, Vivado/Vitis, CMake, Git.

Responsibilities

• Architect and implement high-performance multi-threaded C/C++ userspace apps on embedded Linux.
• Vectorize and optimize critical loops using ARM NEON intrinsics and assembly.
• Develop software drivers/interfaces (UIO, AXI DMA, mem-mapped registers) for FPGA IP blocks.
• Profile and tune for deterministic performance using perf/Valgrind.
• Deliver well-commented, production-grade source with docs and build scripts.

Skills

C/C++ for embedded Linux

ARM NEON optimization

Multi-threaded systems

POSIX threads

Linux performance profiling

Tools

GCC cross-compilation

GDB

Vivado/Vitis

CMake

Git

Job description

Robotics Technologies LLC in Milpitas, CA seeks an expert Embedded Software / Firmware Contractor to design and optimize high-throughput multi-threaded software for embedded Linux on Xilinx MPSoC/RFSoC platforms, interfacing with hardware IP blocks in FPGA.

You will accelerate workloads with ARM NEON, implement robust Linux drivers (UIO, AXI DMA), and deliver production-grade code with full documentation and hand-off materials.