Embedded Design Intern: FPGA/SoC & DSP Hands-On

Leidos; Huntsville (AL); On-site; USD 25,000 - 39,000; Part time

Job summary

Leidos Defense Systems is seeking an Embedded Design Engineering Intern to join the Electrical Systems Department. You will gain hands-on experience across the product life cycle—from concept development through testing and post-delivery support—while exploring DSP, PCB design, and technology evaluations.

This internship offers collaboration with multi-disciplinary teams, exposure to FPGAs, microcontrollers, and real defense projects, and opportunities to develop leadership and technical skills

Qualifications

• Currently enrolled in an accredited college/university and pursuing a degree in Computer Engineering or a related field.
• Experience with C, C++, or Rust embedded software programming through coursework, labs, or internships.
• GPA of 3.0 or higher.
• Must be a US Citizen and able to obtain DoD Secret clearance.

Responsibilities

• Design embedded software and firmware.
• Perform HDL simulations and software unit tests.
• Lab testing with instrumentation and debug/test methods.
• Collaborate with multi-disciplinary teams and work on platforms like FPGAs, microcontrollers, and mixed-signal designs.

Skills

Embedded programming

Teamwork & communication

Problem solving

US citizenship

Education

Pursuing degree in Computer Engineering or related field

GPA 3.0+

Tools

Xilinx RFSoC / FPGA tools

VHDL / Verilog / SystemVerilog

Job description

Leidos Defense Systems is seeking an Embedded Design Engineering Intern to join the Electrical Systems Department. You will gain hands-on experience across the product life cycle—from concept development through testing and post-delivery support—while exploring DSP, PCB design, and technology evaluations.

This internship offers collaboration with multi-disciplinary teams, exposure to FPGAs, microcontrollers, and real defense projects, and opportunities to develop leadership and technical skills