Embedded AI Infrastructure Engineer for Snapdragon DSP/IPC

MaC VC; San Diego (CA); On-site; USD 100,000 - 149,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a versatile software engineer to develop embedded software across the full system stack on Snapdragon processors.

You will design, implement, and optimize core software frameworks powering AI and compute workloads including ML, CV, VR/AR, image/video processing, automotive, IoT, sensors, and more. You will tackle low‑level challenges in IPC, memory management, and DSP acceleration, and collaborate with cross‑functional teams to deliver high‑performance,

Qualifications

• Bachelor's degree in Engineering, CS, CE, EE, or a related field.
• Strong programming skills in C/C++, Java, or Python.
• Solid understanding of computer architecture, operating systems, and embedded systems concepts.
• Knowledge of RTOS and concurrent software design.
• Experience with Linux/Android/Windows multimedia, compute, or driver frameworks.
• Strong problem-solving skills and ability to work independently.

Responsibilities

• Design and implement embedded system software across multiple layers of the software stack.
• Develop and optimize inter‑processor communication (IPC) and memory management solutions.
• Build software frameworks that enable DSP acceleration for AI and multimedia workloads.
• Debug, profile, and optimize system performance across diverse hardware and software environments.
• Collaborate with cross‑functional teams to deliver scalable, high‑performance Snapdragon‑based solutions.

Skills

C

C++

Java

Python

Education

Bachelor's degree in Computer Science, Computer Engineering, Electrical Engineering, Information Systems, or related field

Job description

Qualcomm Technologies, Inc. is seeking a versatile software engineer to develop embedded software across the full system stack on Snapdragon processors.

You will design, implement, and optimize core software frameworks powering AI and compute workloads including ML, CV, VR/AR, image/video processing, automotive, IoT, sensors, and more. You will tackle low‑level challenges in IPC, memory management, and DSP acceleration, and collaborate with cross‑functional teams to deliver high‑performance,