Electronic Assembly Standards and Capital Equipment Engineer

Torrey Holistics; Milwaukee (WI); On-site; USD 120,000 - 180,000; Full time

Job summary

Rockwell Automation seeks an experienced engineering professional to drive global process standards and technology execution for electronic assembly (PCBA). You will partner with Mequon and New Berlin facilities and influence sites worldwide, advancing quality, reliability, and throughput through standardization.

You will own the technology roadmap, apply advanced analytics and Lean Six Sigma, and embed DFM/DFA to accelerate robust product launches across global operations.

Qualifications

• Bachelor's degree in a relevant field is required.
• 7–10+ years in hands-on electronic assembly manufacturing.
• Lean Six Sigma Green Belt+ preferred.
• Proficiency in solder profiling, SMT, post‑SMT, or conformal coat; working knowledge of IPC‑A‑610.

Responsibilities

• Lead global process standards; publish procedures, work instructions, and training.
• Own the technology roadmap; evaluate, justify, and implement next‑gen equipment.
• Lead equipment selection, cost/benefit, purchasing, installation and production release.
• Design and drive DOE; use control charts and statistical analysis; report KPIs; lead DMAIC/DMADV projects.

Skills

Lean Six Sigma

Solder profiling

DOE / DMADV

Statistical analysis

Cross-functional collaboration

Process standardization

Education

Bachelor's degree in Mechanical, Electrical, or Industrial Engineering

Tools

IPC-A-610

Job description

Join a team that sets the bar for electronic assembly at Rockwell AutomationWe’re seeking an experienced engineering professional to drive global process standards and technology execution for electronic assembly (PCBA). You’ll report to the Manager of Manufacturing Process Engineering – PCBA and work closely with our Mequon and New Berlin facilities while influencing sites around the world.Why this role mattersAdvance quality, reliability, and throughput through global standardization.Own the technology roadmap: evaluate, justify, and implement next‑gen equipment.Apply advanced analytics and Lean Six Sigma to continuous improvement.Embed DFM/DFA principles to accelerate robust product launches.Where you’ll focusProcess expertise: Build and sustain deep capability in at least two of the following: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick‑and‑place, SMT reflow, AOI, equipment maintenance & troubleshooting.Standards & governance: Develop global process standards; publish procedures, work instructions, and training; ensure best‑practice conformance across facilities.Capital programs: Lead equipment selection, cost/benefit justification, purchasing, installation, and production release; benchmark emerging solutions; assess plants using common criteria.Analytics & CI: Design and run DOE; use control charts and statistical analysis; report KPIs; drive DMAIC/DMADV projects.Cross‑functional influence: Partner with design for DFM/DFA; integrate assembly needs into Electronic Assembly Design Guidelines; share expertise via presentations and technical reviews.Must‑have qualificationsBachelor's degree in a relevant field.Ability to spend significant time on‑site in Mequon and New Berlin.Legal requirement: Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job openingPreferred backgroundTypically 8 years of experience.BS or MS in Mechanical, Electrical, or Industrial Engineering.7–10+ years in hands‑on electronic assembly manufacturing.Proficiency in solder profiling, SMT, post‑SMT, or conformal coat.Working knowledge of IPC‑A‑610.Lean Six Sigma (Green Belt+ preferred).Technical fluencyBachelor's Degree5 Why (Root Cause Analysis Method)ISO 22000Process EngineeringDesign for Assembly (DFA)Electrical / Electronic SystemsEngineering DegreeAS9100 ExperienceAbout the teamYou’ll join a specialized group at the nexus of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis. The team’s charter: deliver measurable results in quality, reliability, throughput, and long‑term profitability for global electronic assembly operations.