Electrical Engineer - Microelectronics Advanced Packaging

Harris Geospatial Solutions; Palm Bay (FL); On-site; USD 80,000 - 110,000; Full time

Job summary

An established industry player is seeking a Senior Specialist in Advanced Packaging Integration. This pivotal role involves developing advanced packaging assembly processes, including hybrid and thermocompression bonding. You will lead experiments and collaborate with various teams to enhance technology solutions for high-density interconnects. The position offers a unique opportunity to engage with military, government, and commercial clients, driving innovation and excellence in the defense sector. If you are passionate about technology and eager to make an impact, this role could be your next career step.

Benefits

Relocation assistance

Flexible work schedule (9/80)

Professional development opportunities

Qualifications

• 6+ years in semiconductor process engineering or 10 years experience without a degree.
• Experience with die attach and chip-to-wafer bonding is crucial.

Responsibilities

• Lead DOEs and data analysis to create advanced packaging processes.
• Collaborate with development teams to define key technology requirements.

Skills

Semiconductor Process Engineering

Data Analysis

Quantitative Problem Solving

Risk Management

Education

Bachelor's Degree in Materials Science

Bachelor's Degree in Electrical Engineering

Bachelor's Degree in Chemical Engineering

Bachelor's Degree in Mechanical Engineering

Bachelor's Degree in Chemistry

Bachelor's Degree in Physics

Tools

Design of Experiments (DOEs)

Hybrid Bonding

Microbumping

Job description

L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.

L3Harris Technologies is the Trusted Disruptor in the defense industry. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Details

• Job Title: Senior Specialist, Advanced Packaging Integration
• Job Code: 23736
• Job Location: Palm Bay, FL
• Job Schedule: 9/80 (Every other Friday off!)
• Relocation: Relocation assistance may be available to qualified applicants

Job Description

This position is responsible for the development and execution of advanced packaging assembly processes including hybrid and thermocompression bonding. The lead will plan pathfinding experiments and Design of Experiments (DOEs) to generate process and tool knowledge for chip-to-wafer and wafer-to-wafer stacking. This role will necessitate strategic planning working across industry to identify partners, tools, and technologies to develop advanced packaging solutions for high density interconnects. Expertise gained in this position will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers.

Essential Functions

1. Lead DOEs and data analysis to create process technology.
2. Collaborate with development and manufacturing to define needs for key process technology requirements.
3. Engage external vendors and research leaders.
4. Perform quantitative problem solving and drive solutions using risk management.
5. Lead trades to evaluate technology integration strategies, process and metrology tools, and IP technology transfers.
6. Domestic and international travel.

Qualifications

• Bachelor’s Degree in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Chemistry, Physics, or related field and a minimum of 6 years of prior relevant experience or Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related experience.
• 3+ years’ experience in semiconductor process engineering with die attach, chip to wafer, or wafer to wafer bonding.
• Ability to obtain a TS/SCI security clearance.
• Ability for both domestic and international long term field assignments.

Preferred Additional Skills

• Prior integration experience of 3D packaging using through silicon vias, temporary bonding/debonding, wafer thinning, microbumping, and hybrid bonding is preferred.

L3Harris Technologies is proud to be an Equal Opportunity Employer. We are committed to a workplace free from unlawful discrimination and encourage all qualified applicants to apply. All applicants will be considered without regard to race, color, religion, age, national origin, ethnicity, gender, sexual orientation, veteran status, disability, or other protected characteristics. We maintain a drug-free workplace and perform pre-employment substance abuse testing and background checks where permitted by law.