Electrical/Embedded Engineer: Mechatronics & Wireless

LAM RESEARCH Corporation

Fremont (CA)

Hybrid

USD 99,000 - 220,000

Full time

14 days+

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Job summary

Lam Research is seeking an Electrical Engineer in California to design and analyze electronics for advanced wafer handling and sensor systems. You will develop firmware for microcontrollers, create PCBA test plans, and lead hardware integration efforts in a collaborative mechatronics team.

Responsibilities include 70% product design and 30% product management, with opportunities to guide peers and innovate across wireless and power management domains.

Qualifications

  • BS in Electrical Engineering with 2+ years of experience.
  • MSEE with 0+ years.
  • Industrial experience in electronics board and schematics design.
  • Experience with wireless and Bluetooth implementation a plus.
  • Fundamental knowledge of circuit design: ADC, op-amps, battery/power management.
  • Inter-device communication protocols: SPI, I2C, UART.
  • Strong embedded systems firmware development (bare metal/RTOS) in C/C++.
  • Mechatronics and robotics experience is a strong plus.

Responsibilities

  • Lead the development of electronics used in wireless sensor devices and wafer handling robot control and power boards.
  • Develop new PCBA test plan and perform board bring up.
  • Design and implement FW for Cypress, STM32 or TI MCUs.
  • Job functions are 70% product design and 30% product management.
  • Be a subject matter expert and guide other engineers in the design process.

Skills

Embedded firmware (C/C++)
BLE/Wireless
SPI/I2C/UART
Power management
Mechatronics/Robotics

Education

BS in Electrical Engineering
MSEE

Tools

Cypress MCU
STM32 MCU
TI MCU

Job description

Lam Research is seeking an Electrical Engineer in California to design and analyze electronics for advanced wafer handling and sensor systems. You will develop firmware for microcontrollers, create PCBA test plans, and lead hardware integration efforts in a collaborative mechatronics team.

Responsibilities include 70% product design and 30% product management, with opportunities to guide peers and innovate across wireless and power management domains.

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