Electrical Design Engineer

Katalyst CRO; Dublin (OH); On-site; USD 120,000 - 180,000; Full time

Job summary

Katalyst CRO in Dublin, Ohio, seeks a senior mixed-signal/board design engineer to design analog and digital circuits, route high-speed boards for DDR4, PCIe, and QSPI with strict impedance control, and architect complex DC-DC power networks.

You will lead design reviews, mentor engineers, collaborate with firmware, mechanical and software teams, and ensure SI/EMI/EMC compliance, lab verification with DSO, VNAs, and spectrum analyzers.

Qualifications

• Experience in mixed-signal circuit design using practical lab methods.
• Proficiency with high-speed PCB routing and impedance control.
• Ability to design power architectures with bucks/boosts/LDOs.
• Familiarity with ARM Cortex-M, RISC-V, and FPGA ecosystems.
• Strong debugging and root-cause analysis skills.

Responsibilities

• Design and develop analog and digital circuits.
• Route and layout high-speed boards for DDR3/DDR4, PCIe, QSPI with impedance control.
• Design DC-DC power management networks using buck/boost regulators, LDOs, and sequencing.
• Develop systems using ARM Cortex-M, RISC-V, microcontrollers, and FPGAs.
• Ensure signal integrity and EMI/EMC compliance to standards.
• Work with I2C, SPI, UART, RS485, CAN, USB, Ethernet interfaces.
• Lab verification with DSO, logic analyzers, VNA, and spectrum analyzers.
• Perform root-cause analysis and thermal management.
• Provide technical leadership and mentor engineers.
• Project management: schedules, budgets, trade-offs.
• Schematic & PCB design with Xpedition.

Skills

Mixed-signal design

Analog & digital circuits

High-speed PCB design

DDR3/DDR4, PCIe, QSPI

Power management/DC-DC

ARM Cortex-M / RISC-V / FPGA

Signal integrity/ EMI

I2C, SPI, UART, CAN, USB, Ethernet

Xpedition EDA

Lab instrumentation

Tools

Xpedition

Job description

Job Description

• Mixed-Signal Design: Design and develop analog and digital circuits.
• High-Speed Board Design: Handle routing and layout for DDR3/DDR4, PCIe, and QSPI interfaces with strict impedance control.
• Power Tree Architecture: Design complex DC-DC power management networks using buck and boost regulators, LDO regulators, and power sequencing.
• Processor & FPGA Design: Develop systems using ARM Cortex-M, RISC-V, microcontrollers, advanced microprocessors, and FPGAs.
• Signal Integrity & EMI/EMC: Mitigate noise, crosstalk, and electromagnetic interference to meet FCC, CE, automotive, and aerospace standards.
• Communication Protocols: Work with I2C, SPI, UART, RS485, CAN, USB, and Ethernet interfaces.
• Lab Verification: Use digital storage oscilloscopes (DSO), logic analyzers, vector network analyzers (VNA), and spectrum analyzers.
• Root-Cause Analysis: Perform component-level troubleshooting, derating analysis, and thermal management.
• Technical Leadership: Mentor engineers, lead design reviews, and coordinate with firmware, mechanical, and software teams.
• Project Management: Prepare architectural trade-off analyses, component selection matrices, project schedules, and budgets.
• Schematic & PCB Design Tools: Demonstrate proficiency with enterprise EDA tools, particularly Xpedition.

Key Responsibilities

• Mixed-Signal Design: Design and develop analog and digital circuits.
• High-Speed Board Design: Handle routing and layout for DDR3/DDR4, PCIe, and QSPI interfaces with strict impedance control.
• Power Tree Architecture: Design complex DC-DC power management networks using buck and boost regulators, LDO regulators, and power sequencing.
• Processor & FPGA Design: Develop systems using ARM Cortex-M, RISC-V, microcontrollers, advanced microprocessors, and FPGAs.
• Signal Integrity & EMI/EMC: Mitigate noise, crosstalk, and electromagnetic interference to meet FCC, CE, automotive, and aerospace standards.
• Communication Protocols: Work with I2C, SPI, UART, RS485, CAN, USB, and Ethernet interfaces.
• Lab Verification: Use digital storage oscilloscopes (DSO), logic analyzers, vector network analyzers (VNA), and spectrum analyzers.
• Root-Cause Analysis: Perform component-level troubleshooting, derating analysis, and thermal management.
• Technical Leadership: Mentor engineers, lead design reviews, and coordinate with firmware, mechanical, and software teams.
• Project Management: Prepare architectural trade-off analyses, component selection matrices, project schedules, and budgets.
• Schematic & PCB Design Tools: Demonstrate proficiency with enterprise EDA tools, particularly Xpedition.

Required Skills

• Mixed-signal, analog, and digital circuit design.
• High-speed PCB design and routing.
• DDR3/DDR4, PCIe, and QSPI interfaces.
• Power management and DC-DC converters.
• ARM Cortex-M, RISC-V, and FPGA ecosystems.
• Signal integrity and EMI/EMC compliance.
• Communication protocols and laboratory instrumentation.
• Component-level debugging and root-cause analysis.
• Xpedition EDA tools.