Dry Etch Process, Engineer to Manager

Morgan Philips Group; Oklahoma City (OK); On-site; USD 150,000 - 210,000; Full time

Job summary

Morgan Philips Group is seeking a senior engineer to lead development, characterization, and optimization of advanced Dry Etch processes for cutting-edge memory structures. You will collaborate with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.

You will define technical roadmaps aligned with memory scaling and yield goals, evaluate next-generation etch technologies, mentor junior engineers, and present findings and strategic plans to

Qualifications

• PhD or MS in a relevant technical field is required.
• Hands-on Dry Etch process development experience, preferably in DRAM or memory tech.
• Proven leadership and ownership of semiconductor process projects.
• Deep understanding of plasma etch mechanisms, control, and defect mitigation.

Responsibilities

• Lead development, characterization, and optimization of advanced Dry Etch processes for memory structures.
• Collaborate with integration, metrology, equipment, and R&D teams to ensure robustness and manufacturability.
• Define technical roadmaps aligned with memory scaling requirements and yield goals.
• Evaluate next-generation etch technologies, chemistries, and hardware platforms.
• Mentor junior engineers and drive a culture of technical excellence.
• Interface with equipment vendors and global partners to co-develop solutions.
• Drive root cause analysis and continuous improvement for yield limiters.
• Present findings and roadmaps to executive leadership and global teams.

Skills

Leadership

Cross-functional collaboration

Process optimization

Root cause analysis

Data analytics

DOE/ SPC

Education

Ph.D. or Master’s in Electrical Eng., Materials Science, Chemical Eng., Physics

Tools

Lam Research

TEL

AMAT

Job description

Responsibilities

• Lead the development, characterization, and optimization of advanced Dry Etch processes for cutting-edge memory structures.
• Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
• Define and execute technical roadmaps aligned with advanced memory scaling requirements and yield improvement goals.
• Evaluate and implement next-generation etch technologies, novel chemistries, and advanced hardware platforms.
• Mentor and guide junior engineers, fostering a culture of innovation and technical excellence.
• Interface with strategic equipment vendors and global partners to co-develop innovative solutions.
• Drive root cause analysis and continuous improvement initiatives for complex, process-related yield limiters.
• Present technical findings, strategic roadmaps, and project recommendations to executive leadership and global teams.

Qualifications

• Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline.
• Hands-on experience in Dry Etch process development, with a strong preference for background in DRAM or advanced memory technologies.
• Proven track record of technical leadership and project ownership in semiconductor process engineering.
• Deep understanding of plasma etch mechanisms, advanced process control, and defect mitigation strategies.
• Extensive experience with industry-standard advanced etch tools (e.g., Lam Research, TEL, AMAT) and complex characterization techniques.
• Strong analytical, problem-solving, and cross-cultural communication skills.
• Demonstrated ability to lead cross-functional teams and manage complex, multi-site projects.

Preferred Skills

• Specialized experience with high aspect ratio etching, critical dimension (CD) control, and selectivity challenges in advanced memory nodes.
• Familiarity with advanced data analytics, Design of Experiments (DOE) methodologies, and Statistical Process Control (SPC) tools.
• Comprehensive knowledge of integration challenges in sub-20nm memory technology nodes.