Dry Etch Process Engineer - Advanced Memory Tech

Micron Technology; City of Albany (NY); On-site; USD 107,000 - 182,000; Full time

Benefits offered by this job

Paid time-off

Paid family leave

Comprehensive benefits package

Job summary

Micron Technology, based in Albany, NY, is seeking a Dry Etch Process Engineer responsible for developing and optimizing plasma etch processes in memory device manufacturing. This full-time role involves hands-on work with etch equipment and collaboration with teams across global locations.

The ideal candidate will hold a relevant master's or doctoral degree or a bachelor's with significant related experience, focusing on equipping teams with necessary tools and knowledge for next-generation device production.

Qualifications

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related field.
• 3+ years of semiconductor processing experience focused on dry etch/plasma etch.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization.

Responsibilities

• Develop, qualify, and sustain dry etch unit processes for advanced memory technologies.
• Optimize critical process metrics including CD control and uniformity.
• Perform root-cause analysis and implement corrective actions for process excursions.

Skills

Semiconductor processing

Data-driven methods

Plasma etch fundamentals

Statistical data analysis

Collaboration skills

Education

M.S. or Ph.D. in relevant field

B.S. with 3+ years experience

Job description

Micron Technology, based in Albany, NY, is seeking a Dry Etch Process Engineer responsible for developing and optimizing plasma etch processes in memory device manufacturing. This full-time role involves hands-on work with etch equipment and collaboration with teams across global locations.

The ideal candidate will hold a relevant master's or doctoral degree or a bachelor's with significant related experience, focusing on equipping teams with necessary tools and knowledge for next-generation device production.