Dry Etch Process Develop Engineer

1000 Micron Technology, Inc.; City of Albany (NY); On-site; USD 107,000 - 182,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time-off program

Robust benefit programs

Job summary

1000 Micron Technology, Inc. is looking for a Dry Etch Process Engineer in Albany, New York. This full-time position involves developing and optimizing plasma etch processes critical for next-generation memory devices.

The successful candidate will work closely with cross-functional teams, implementing process improvements and collaborating on technology transfers for high‑volume manufacturing.

Qualifications

• M.S. or Ph.D. in Electrical Engineering, Materials Science, or related field.
• 3+ years of semiconductor processing experience, especially in dry etch.
• Experience with semiconductor process development or DOE planning.

Responsibilities

• Develop and sustain dry etch unit processes for memory technologies.
• Optimize process metrics such as dimension control and etch profile.
• Drive defect reduction and yield improvement through data analysis.

Skills

Collaboration across teams

Process optimization

Statistical data analysis

Root-cause analysis

Education

M.S. or Ph.D. in relevant technical field

B.S. with 3+ years of experience

Tools

Advanced dry etch platforms

Inline/out-of-line metrology

Job description

Job Summary

Dry Etch Process Engineer at Micron Technology's Technology Development organization. Responsible for developing, integrating, and optimizing plasma etch processes for next‑generation memory devices. Collaborates with integration, lithography, thin‑film, CMP, device, and manufacturing teams to mature processes from R&D to high‑volume manufacturing. Full‑time position located at Albany, New York (NYC site). Works closely with EUV Photo Lithography team and Technology Development teams in Boise, USA and Hiroshima, Japan.

Responsibilities

• Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (dielectric, conductor, hardmask).
• Optimize critical process metrics including critical dimension control, etch profile/anisotropy, selectivity, microloading, uniformity, and line‑edge/line‑width roughness.
• Drive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.
• Perform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.
• Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.
• Document process baselines, change controls, and learnings; communicate results and support technology transfer to high‑volume manufacturing.

Minimum Qualifications

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing.
• B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch (also considered).
• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Ability to collaborate effectively across cross‑functional technical teams and communicate results clearly.

Preferred Qualifications

• Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization techniques and tool health monitoring methodologies.
• Experience working with semiconductor equipment vendors, joint development programs, or R&D environments.
• Familiarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.

Salary

Estimated range: $107,000.00 – $182,000.00 per year (base). Additional compensation may include benefits, bonuses, and equity.

Benefits

• Medical, dental, and vision plans.
• Income protection for illness or injury.
• Paid time‑off program and paid holidays.
• Paid family leave.
• Robust benefit programs that help protect income and prepare for the future.

Equal Employment Opportunity

Micron is an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.