Dry Etch Process Engineer - 28nm Ramp & High-Volume Fab

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 110,000 - 150,000; Full time

Job summary

LFAB (Lehi Fab) in Utah seeks an experienced Dry Etch Process Engineer to ramp 28nm technology and support a high-volume 300mm wafer fab. You will help drive process development, yield improvement, and equipment startup for new tech.

Ideal candidates have 5+ years in dry/plasma etch, a strong SPC/EC/Crew change control background, and hands-on experience with advanced nodes (28nm or below). The role focuses on process optimization and close collaboration with cross-functional teams.

Qualifications

• 5 years of experience in Dry/Plasma etch process engineering.
• Strong foundation in statistical process control, engineering change control and process release strategies.
• Experience with 28nm and below.

Responsibilities

• Support manufacturing operations
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for efficiency, cost reduction or quality improvement programs
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Participate in data analysis and problem resolution

Skills

Dry etch

Plasma etch

Education

Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field

Job description

LFAB (Lehi Fab) in Utah seeks an experienced Dry Etch Process Engineer to ramp 28nm technology and support a high-volume 300mm wafer fab. You will help drive process development, yield improvement, and equipment startup for new tech.

Ideal candidates have 5+ years in dry/plasma etch, a strong SPC/EC/Crew change control background, and hands-on experience with advanced nodes (28nm or below). The role focuses on process optimization and close collaboration with cross-functional teams.