Distinguished Technical Staff, Advanced Packaging Strategic Initiatives

Lumentum; United States; Remote; USD 156,000 - 224,000; Full time

Job summary

Lumentum is seeking a Senior technology leader to advance our packaging strategy in optical transceivers and components. The role involves developing a roadmap, defining architecture, and engaging with customers to enhance product differentiation. Candidates should possess a strong background in optical packaging and leadership experience.

Qualifications

• 15+ years experience in optical and CMOS packaging.
• Proven leader in advanced packaging with focus on interconnect products.
• Extensive experience with advanced packaging technology.

Responsibilities

• Owns companywide 2D, 2.5D, and 3D packaging roadmap.
• Leads architecture and design for early-stage product concepts.
• Represents Lumentum at industry events.

Skills

Optical packaging

CMOS packaging

Communication

Education

MS, PhD, Electrical Engineering

Photonics

Tools

CoWoS

Fan-out package

Die stacking

Job description

Distinguished Technical Staff, Advanced Packaging Strategic Initiatives

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Lumentum Holdings is seeking an experienced, passionate Senior technology leader to drive our advanced packaging strategy. In this critical role, you will engage with executive and engineering leadership to define and drive the packaging roadmap for optical transceivers, high speed components, and advanced co-packaged optics solutions. You will engage with key customers to constantly iterate our approach, and drive solutions that create technology differentiation along our product lines. The successful candidate will also drive product definition and product architecture for our advanced packaging focused activities, making tradeoffs that balance technical risk with financial returns and time to market

Key responsibilities:

• Owns companywide 2D, 2.5D, and 3D packaging roadmap and technology development.
• Works closely with current module partners to create differentiation for Lumentum products.
• Drives long term partnerships for all forward looking packaging related technology development.
• Leads the architecture, design, and initial product definition for Lumentums’ early-stage product concepts, making the appropriate tradeoffs between technical and business risk.
• Represents Lumentum at various standards and industry leading events.

Education

• MS, PhD, Electrical Engineering, Photonics, or related field.

Qualifications:

• 15+ years experience within the optical and CMOS packaging. Direct experience bringing new technology to market highly preferred.
• Proven, knowledgeable leader within advanced packaging space with specific focus on interconnect products and chiplets.
• History of delivering cutting edge optical products into the market under competitive market conditions. History of product definition and high level of product differentiation.
• Extensive experience with advanced packaging technology including CoWoS, fan out package on package, die stacking, and
• Strong understand and relationships with packaging OSATs. Experience working with OSATs to bring advanced packaging products to market.
• Excellent knowledge of how to assess packaging related challenges, including stress, strain, warpage, and deformation. Ability to model and take the lead on assessing packaging risk is a major plus.
• Excellent written, presentation, and communication skills.

Pay Range:

P90-USA-1 :$156,800.00 - $224,000.00

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Lumentum Holdings is seeking an experienced, passionate Senior technology leader to drive our advanced packaging strategy. In this critical role, you will engage with executive and engineering leadership to define and drive the packaging roadmap for optical transceivers, high speed components, and advanced co-packaged optics solutions. You will engage with key customers to constantly iterate our approach, and drive solutions that create technology differentiation along our product lines. The successful candidate will also drive product definition and product architecture for our advanced packaging focused activities, making tradeoffs that balance technical risk with financial returns and time to market

Key responsibilities:

• Owns companywide 2D, 2.5D, and 3D packaging roadmap and technology development.
• Works closely with current module partners to create differentiation for Lumentum products.
• Drives long term partnerships for all forward looking packaging related technology development.
• Leads the architecture, design, and initial product definition for Lumentums’ early-stage product concepts, making the appropriate tradeoffs between technical and business risk.
• Represents Lumentum at various standards and industry leading events.

Education

• MS, PhD, Electrical Engineering, Photonics, or related field.

Qualifications:

• 15+ years experience within the optical and CMOS packaging. Direct experience bringing new technology to market highly preferred.
• Proven, knowledgeable leader within advanced packaging space with specific focus on interconnect products and chiplets.
• History of delivering cutting edge optical products into the market under competitive market conditions. History of product definition and high level of product differentiation.
• Extensive experience with advanced packaging technology including CoWoS, fan out package on package, die stacking, and
• Strong understand and relationships with packaging OSATs. Experience working with OSATs to bring advanced packaging products to market.
• Excellent knowledge of how to assess packaging related challenges, including stress, strain, warpage, and deformation. Ability to model and take the lead on assessing packaging risk is a major plus.
• Excellent written, presentation, and communication skills.

Pay Range:

P90-USA-1 :$156,800.00 - $224,000.00

Disclaimer:

Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.

About the company

Lumentum is a market-leading manufacturer of innovative optical and photonic products enabling optical networking and commercial laser customers worldwide.

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