Director – Superchip SoC Technical Program Manager

Arm; Austin (TX); Hybrid; USD 308,600 - 417,500; Full time

Benefits offered by this job

Hybrid work model

Job summary

Arm in Austin, Texas seeks a Senior Technical Program Manager to lead the end-to-end SoC program, steering schedule, tapeout readiness, and multi-die coordination across Die TPMs and Functional TPMs.

You will partner with chip leads and engineering management to ensure delivery on time and within budget, manage risks, and report progress to executives; a strong cross-functional, influential leadership style is required.

Qualifications

• Bachelor’s or Master’s degree in Electrical/Computer Engineering, Computer Engineering, Computer Science or related field.
• 20+ years of semiconductor shown experience.
• Minimum 5 years of Technical Program Management experience leading large-scale SoC programs.
• Proven experience leading development and finalization of sophisticated datacenter-class SoCs.

Responsibilities

• Lead the overall SoC execution plan, coordinated master schedule, and tapeout readiness.
• Coordinate Die TPMs to maintain consistency across all silicon dies.
• Drive cross-die integration, dependencies, critical path, and engineering readiness.
• Partner with Functional TPMs to supervise execution health, review metrics, and drive deep dives.
• Work with Chip Leads, Die Leads, Domain Leads and Engineering Managers for aligned execution.
• Own program risk management, mitigation planning, and executive issues.

Skills

Leadership

Program Mgmt

Cross-functional

Risk Mgmt

Executive Communication

Education

Bachelor’s or Master’s in Electrical/Computer Engineering or related field

Job description

Job ID 2026-18263 Date posted 27/07/2026 Location Austin, Texas Category Operations

The Superchip SoC TPM advises the effective completion and tapeout of a complex multi-die SoC. This role takes charge of the full SoC program, steering the schedule, leading cross-die interactions, mitigating risks, verifying engineering readiness, and providing executive supervision. Those in the TPM role for Superchip collaborate closely with Die TPMs, Functional TPMs, and engineering management. They function as the program’s orchestrator. Their role secures delivery according to schedule, budget, and quality requirements!

Responsibilities

• Lead the overall SoC execution plan, coordinated master schedule, and tapeout readiness!
• Lead and coordinate Die TPMs to maintain consistency across all silicon dies.
• Drive cross-die integration, dependencies, critical path, and engineering readiness.
• Partner with Functional TPMs (Front-End, Verification & Validation, Physical Build, Power & Performance, IP Management, Early Enablement, Post-Silicon, and Solution Engineering) to supervise execution health, review metrics, and drive focused deep dives where required.
• Work closely with Chip Leads, Die Leads, Domain Leads, IP Technical Leads, and Engineering Managers to maintain technical and execution alignment.
• Own overall program risk management, mitigation planning, and executive issues.
• Coordinate and lead major SoC governance events, including landmark reviews, architecture reviews, tapeout readiness reviews, executive reviews, and multi-functional readiness reviews.
• Partner with the IP Management TPM to guarantee Third Party IP planning, vendor readiness, and IP reviews align with program objectives.
• Coordinate with the Post-Silicon TPM during the pre-silicon phase to ensure validation planning, lab readiness, resource planning, and smooth ownership transition after tapeout.
• Collaborate with the Solution TPM to ensure alignment on board readiness, software enablement, customer platform requirements, and overall solution planning.
• Consolidate program metrics, analyze trends, provide actionable insights, and support executive decision-making.
• Supervise overall program resources and engineering costs to ensure execution remains aligned with business objectives.

Required Skills And Experience

• Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 20+ years of semiconductor shown experience.
• Minimum 5 years of Technical Program Management experience leading large-scale SoC programs.
• Confirmed experience leading the development and finalization of sophisticated datacenter-class SoCs.
• Strong understanding of the complete SoC development lifecycle from architecture through tapeout.
• Demonstrated ability to lead large multi-functional engineering organizations without direct authority.
• Technical expertise and experience in one or more of the silicon build functional areas.

Desired Skills And Experience

• Experience with multi-die/chiplet architectures.
• Experience leading multiple Die TPMs and Functional TPMs.
• Experience with Hyperscalers or AI/datacenter silicon.
• Strong executive communication and collaborator leadership skills.

We're looking for a collaborative and hardworking Technical Program Manager to join our team and help drive the successful delivery of next-generation SoC programs. The ideal candidate combines strong technical competence with outstanding program management and leadership skills, enabling them to partner effectively with engineering leaders while orchestrating sophisticated, multi-functional initiatives. In this role, you'll bring teams together around a shared vision, anticipate and mitigate risks, make data-driven decisions, and develop alignment across multiple organizations. As the Superchip TPM, you'll play a pivotal role in connecting people, technology, and execution—ensuring our SoC programs are delivered on schedule, within budget, and to the highest quality standards. If you enjoy solving sophisticated challenges, influencing without authority, and working alongside elite engineers to build industry-leading technology, we'd love to hear from you.

Salary Range

$308,600-$417,500 per year

We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.

Hybrid Working at Arm

Arm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

Equal Opportunities at Arm

Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.