Director Pathfinder Solutions - Integrated Materials Solutions

Applied Materials, Inc.

City of Albany (NY)

On-site

USD 176,000 - 242,000

Full time

14 days+
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Job summary

Applied Materials, Inc. in Albany, NY, seeks a Director of Pathfinding Solutions to lead integrated process development for next-generation logic and memory devices, interfacing across product BUs to de-risk pathfinding solutions.

This highly technical role emphasizes hands-on execution, DTCO analysis, and close collaboration with customers such as Samsung, Intel, and TSMC, while influencing roadmaps through data-driven insights.

Qualifications

  • Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
  • 10+ years of semiconductor process development experience.
  • Proven track record in FEOL/MOL/BEOL process integration.
  • Strong publication record or patents in semiconductor tech.
  • Experience engaging with customer technical teams at major manufacturers.

Responsibilities

  • Develop and demonstrate integrated pathfinding process solutions for logic and memory devices.
  • Drive DTCO analysis and cross-BU technical integration across multiple process modules.
  • Engage directly with senior customers, presenting data and aligning on priorities.
  • Coordinate wafer flow, DOE design, and data analysis across BU tools.
  • Publish findings at premier conferences and contribute to patent portfolio.

Skills

Process development
DTCO
Device engineering
Customer engagement
Technical leadership

Education

Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related semiconductor discipline

Job description

Who We AreApplied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.What We OfferSalary:$176,000.00 - $242,000.00Location:Albany,NYYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .Role SummaryThe Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes.This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise, creativity, and execution.Key ResponsibilitiesPathfinding Solution DevelopmentDevelop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architecturesDrive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flowsIdentify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysisTranslate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutionsCross-BU Technical IntegrationWork across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated valuePartner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirementsCollaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modulesCustomer Technical EngagementEngage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding prioritiesLead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshopsTranslate customer integration challenges into Applied-actionable development programs and demo plansSupport customer co-development engagements by providing deep process expertise and integration guidanceTechnical Thought LeadershipPublish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfindingBuild a strong patent portfolio in advanced process integration and pathfinding solutionsContribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineersStay at the forefront of semiconductor technology trends — including device architecture evolution, new materials, and emerging integration challengesQualificationsRequiredPh.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline10+ years of experience in semiconductor process development, integration, or device engineering — with deep expertise in FEOL, MOL, or BEOL process technologiesDemonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodesStrong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolioExperience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers)Deep understanding of device physics, process-structure-property relationships, and DTCO principlesAbility to work effectively across organizational boundaries — coordinating with multiple BUs, product teams, and customer organizationsExceptional analytical, problem-solving, and communication skillsPreferredExperience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologiesTrack record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designationExperience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, or 4F2 DRAM, NANDFamiliarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approachesPrior experience at a leading semiconductor manufacturer in a process integration or device engineering roleStrong network in the semiconductor technical communityWhat Sets This Role ApartThis is not a management or strategy role — it is a deeply technical, hands-on position for someone who thrives on solving the hardest process integration challenges in the semiconductor industry. The ideal candidate will mirror the profile of our top-performing technical leaders who:Own end-to-end pathfinding solutions from concept through customer demonstrationAre recognized as go-to technical experts by both internal teams and external customersCan independently drive complex multi-BU process development programsCombine deep domain expertise with broad integration thinkingElevate Applied's technical brand through publications, patents, and customer engagementsOperate with high autonomy and impact at the intersection of technology and customer valueAdditional InformationTime Type:Full timeEmployee Type:Assignee / RegularTravel:Yes, 10% of the TimeRelocation Eligible:YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
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