Director of Fab Process Engineering, Semiconductor

Skorpios Technologies, Inc.

Temecula (CA)

On-site

USD 175,000 - 225,000

Full time

14 days+

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Benefits offered by this job

Competitive Salary
Medical
Dental
Vision
401(k)
Company paid Life Insurance
Company paid Disability
Paid Holidays
Paid Vacation
Gym Membership Discounts

Job summary

Skorpios Technologies, Inc. is seeking a Director of Process Engineering to lead Lithography, Etch, Thin Films, and CMP teams for high-yield, scalable manufacturing in our Temecula fab.

You will drive SPC, DOE, and FMEA programs, work with Process Integration on technology transfer, and manage tool acquisitions and 24/7 production support. Strong leadership and collaboration across functions are essential to succeed.

Qualifications

  • 8+ years in Semiconductor/MEMS process engineering in a cleanroom/Fab.
  • Experience leading technical engineering teams.
  • Expertise in unit processes: CVD, PVD, ALD, Dry/Wet Etch, Photolithography, CMP.

Responsibilities

  • Lead unit process engineering teams across Lithography, Etch, Thin Films, and CMP to deliver scalable solutions.
  • Champion SPC, DOE, and FMEA to reduce variability and scrap.
  • Collaborate with Maintenance to optimize tool uptime and PM criteria.
  • Transfer new unit processes to production via Process Integration.
  • Drive CIP to reduce cycle times and wafer costs.
  • Oversee capital equipment evaluations and vendor relationships.
  • Present module health metrics to executives and stakeholders.
  • Provide 24/7 technical oversight to support 24/7 production.

Skills

Semiconductor process engineering
SPC
DOE
FMEA
Lean manufacturing
Data analysis
Cross-functional collaboration
Leadership
Troubleshooting

Education

Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field

Tools

JMP
Minitab

Job description

Description

Job Purpose

The Director of Process Engineering is responsible for leading the unit process engineering teams (including Lithography, Etch, Thin Films, and CMP) to ensure tool capability, process stability, and operational excellence in the Fab. This role drives robust equipment utilization, statistical process control (SPC), and unit-level process optimizations to support high-yielding, scalable manufacturing. The Director collaborates closely with Process Integration to productize new technologies, manages vendor relationships for tool acquisitions, and provides 24/7 technical oversight to ensure continuous, high-volume production.

Essential Responsibilities
  • Module Ownership & Scalability: Lead and manage the unit process engineering teams (Lithography, Etch, Thin Films, Diffusion, and CMP) to deliver stable, repeatable, and scalable manufacturing solutions.
  • Process Control & Stability: Champion Statistical Process Control (SPC), Design of Experiments (DOE), and Failure Mode and Effects Analysis (FMEA) across all modules to reduce process variability, eliminate scrap, and maximize baseline yield.
  • Tool Capability & Equipment Optimization: Partner with Maintenance and Equipment Engineering to optimize tool uptime, match chamber capabilities, and define rigorous preventative maintenance (PM) qualification criteria.
  • Technology Transfer & NPI Support: Collaborate closely with the Process Integration team to source, develop, and qualify new unit processes required for New Product Introductions (NPI) and technology transfers into production.
  • Continuous Improvement & Cost Reduction: Drive continuous improvement programs (CIP) centered on minimizing cycle time, improving raw process times, optimizing chemical/material consumption, and lowering overall wafer cost.
  • Vendor & Capital Management: Lead technical evaluations for new equipment acquisition, manage vendor relationships, and oversee the installation, qualification, and start-up of new Fab tools.
  • Executive & Cross-Functional Communication: Prepare and present module health metrics, capacity constraints, tool qualification timelines, and engineering updates to executive leadership and cross-functional stakeholders.
  • Fab Engagement & Technical Escalation: Provide hands‑on, high‑level technical troubleshooting in the Fab for complex process excursions; support 24/7 production schedules to ensure minimal disruption to manufacturing lines.
Supervisory Responsibilities
  • Accomplish department objectives by organizing, monitoring, and directing the work of unit process engineering managers and staff.
  • Manage the full employee lifecycle for the process engineering team, including recruiting, onboarding, training, and professional development.
  • Set clear, module‑specific performance goals, monitor progress, and provide consistent engineering coaching and mentorship.
Competencies
  • Technical Mastery: Deep, expert‑level knowledge of advanced semiconductor unit processes, equipment capabilities, and the fundamental physics/chemistry of Fab tools.
  • Operational Excellence: Proven track record in lean manufacturing, SPC management, tool‑matching strategies, and high‑volume manufacturing (HVM) line stabilization.
  • Influence & Collaboration: Exceptional ability to align priorities and collaborate across Process Integration, Equipment Engineering, Operations, and Maintenance teams.
  • Analytical Skills: Advanced data analysis capabilities using yield management software, statistical tools (JMP, Minitab, or equivalent), and data‑driven root cause analysis.
  • Adaptability & Leadership: Ability to lead a highly technical team through rapid scaling, tight production timelines, and complex technical excursions.
Requirements
  • Education: Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related scientific/engineering discipline.
  • Industrial Experience: 8+ years of direct experience in Semiconductor/MEMS process engineering, specifically within a cleanroom/Fab manufacturing environment.
  • Leadership: 3+ years of demonstrated experience managing technical engineering teams or unit module groups.
  • Technical Proficiency: Comprehensive expertise in multiple unit processes, including but not limited to Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Atomic Layer Deposition (ALD), Dry/Wet Etch, Photolithography, and Chemical Mechanical Planarization (CMP).
Preferred Qualifications
  • PhD with a research focus directly applicable to advanced semiconductor processing or unit modules.
  • Six Sigma Green Belt or Black Belt certification.
  • Direct experience managing capital equipment (CapEx) acquisition budgets and tool installation/qualification cycles.
Work Environment & Physical Demands
  • Environment: Primarily performed in a temperature‑controlled setting with an open cubicle layout, alongside significant active time inside the cleanroom Fab.
  • Fab Activity: Frequent walking and standing in the Fab for prolonged periods; required to wear full cleanroom attire (PPE) including bunny suits, hoods, masks, and safety glasses.
  • Physical Requirements: Ability to sit or stand for prolonged periods; occasionally lift or move up to 50 lbs (e.g., tool components or wafer carriers); ability to reach, bend, and squat to inspect tools in confined spaces.
  • Travel: Less than 25% anticipated (primarily vendor or equipment site visits).
Why Skorpios?

At Skorpios, you will be at the forefront of the silicon photonics revolution. We offer the chance to work on truly disruptive technology that is changing how the world connects. You will be part of a team where technical excellence is celebrated and where your contributions have a direct impact on the success of our next‑generation product lines.

Skorpios Offers An Excellent Benefits Package Which Includes
  • Competitive Salary
  • Medical
  • Dental
  • Vision
  • 401(k)
  • Company paid Life Insurance
  • Company paid Disability
  • Paid Holidays
  • Paid Vacation
  • Gym Membership Discounts
Export Control / ITAR Statement

This position is located at a facility that operates under International Traffic in Arms Regulations (ITAR). All applicants must be 'U.S. persons' within the meaning of ITAR. ITAR defines a 'U.S. person' as a U.S. Citizen, U.S. Permanent Resident (i.e., 'Green Card Holder'), Political Asylee, or Refugee.

Skorpios Technologies, Inc. is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity or expression, national origin, ancestry, age (40 and over), physical or mental disability, medical condition, genetic information, marital status, military or veteran status, protected leave status, or any other characteristic protected by applicable federal, state, or local laws.

As a federal contractor, Skorpios Technologies, Inc. takes affirmative action to employ and advance in employment qualified minorities, women, protected veterans, and individuals with disabilities. We encourage all qualified candidates to apply.

Skorpios Technologies, Inc. is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans in our job application procedures. If you need assistance or accommodation due to a disability, you may contact us at AskHR@Skorpiosinc.com.

Work Environment

Work is primarily performed in a temperature‑controlled, open cubicle setting. Frequent interruptions and conversational noise can be expected. This role may also require occasional work in a manufacturing or cleanroom environment.

Work Authorization/Security Clearance Requirements

Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.

Compensation And Benefits

Skorpios embraces a Total Compensation philosophy that includes a base salary and eligibility for overtime for non‑exempt roles.

We offer a comprehensive and competitive benefits package designed to support employee health, welfare, and retirement. Highlights include healthcare benefits, a 401(k) savings plan, and paid time off.

Expected salary range: $175,000 – $225,000, depending on qualifications and experience. The actual starting rate will be determined based on role‑related criteria, including educational qualifications or equivalent experience, relevant work history, and the skills required for the role.

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