Director of Hardware Engineering

Broadcom; United States; Remote; USD 150,000 - 200,000; Full time

Job summary

A leading company seeks a Director Hardware Engineer to lead the design of high-performance electronic products. This role involves overseeing hardware design, product lifecycle, and leading a talented team in a dynamic, fast-paced environment. Candidates should have extensive experience and a strong educational background to drive innovation and results.

Qualifications

• 15+ years of experience in hardware engineering and development.
• Experience with large high-powered SoCs and advanced packaging technologies.
• Proficient in high-speed signaling and thermal management.

Responsibilities

• Lead a design team in developing ultra high-performance electronic products.
• Manage all aspects of EE hardware design and lifecycle.
• Collaborate with interdisciplinary engineering teams.

Skills

Team Leadership

High-speed Hardware Design

Power and Thermal Management

Signal Integrity

Lifecycle Product Ownership

Education

Bachelor's Degree in Electrical Engineering

Tools

Precision Scopes

Analyzers

Development Tools

Validation Tools

Job description

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Job Description:

As a Director Hardware Engineer, you will be the technical lead responsible for a design team developing and delivering ultra high-performance electronic products. In addition to team leadership, technical leads participate in the process and are expected to own and design critical pieces of a solution. We seek candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products.

You will own all aspects of EE hardware design, including BOM creation, vendor negotiations, circuit/board design, development, and validation of a product range. Our cradle-to-grave lifecycle product development means ownership extends beyond product shipment. You will assist with customer trials, field issues, and product sustaining. You will promote a philosophy of small teams of experienced engineers supporting a "One Person One Board" development culture.

You will collaborate with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. Additionally, joint development programs may require extensive interaction with partner engineering teams at an engineering leadership level.

Key Qualifications & Experience:

• Team Lead of high-speed hardware designers.
• Experience with large high-powered SoCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories.
• Proficiency with precision scopes, analyzers, development, and validation tools.
• Understanding of power and thermal issues related to PCBs with 1kW+ footprints.
• Experience with high-speed & high-density signaling, including SerDes rates of 112G+.
• Demonstrated lifecycle product ownership of complex products, from inception to volume production.
• Ability to work with support groups such as Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
• Bachelor's degree in electrical engineering and 15+ years of experience.

Broadcom is proud to be an equal opportunity employer. We consider qualified applicants regardless of race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by law. We also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside the USA, please ensure you fill out a home address, as this will be used for future correspondence.