Director of Engineering

EXO Talent Partners; Orlando (FL); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Relocation supported

Cross-training culture

Job summary

EXO Talent Partners is conducting a confidential, retained search for a Director of Engineering in the greater Orlando, FL area. This is a hands-on leadership role on a lean, fast-moving shop where engineering decisions move the business and you are expected to be on the floor with the team.

The ideal candidate will have deep technical breadth across process, packaging and test for hi-rel microelectronics, plus strong leadership and a track record of mentoring diverse teams.

Qualifications

• Degree in Electrical Engineering strongly preferred; mechanical/electromechanical background acceptable.
• Leadership experience in hi-rel, hybrid microelectronics, semiconductors, or defense electronics manufacturing.
• Genuine hands-on depth with the ability to work on the floor and earn respect.
• Breadth across disciplines valued over deep specialization.

Responsibilities

• Technical leadership across process, packaging, and test engineering for hi-rel microelectronics.
• Hands-on support to the team on complex problems from design to failure analysis.
• Developing engineers and building a cross-trained, high-ownership team.
• Partnering with operations, quality, and program management to deliver reliable hardware.

Skills

Hands-on engineering

Technical leadership

Cross-disciplinary

Mentoring engineers

Education

Electrical or Mechanical engineering degree

Job description

Director of Engineering — Confidential Search

EXO Talent Partners is conducting a confidential, retained search for a Director of Engineering on behalf of an established high-reliability microelectronics manufacturer in the greater Orlando, FL area. This is a hands-on leadership seat at a lean, fast-moving operation where engineering decisions visibly move the business. It is not a manage-from-the-office role. The right leader is technically deep, comfortable on the floor, and energized by building and mentoring a team across disciplines.

What you'll own

• Technical leadership across process, packaging, and test engineering for hi-rel microelectronic assemblies (wire bond, die attach, hybrid packaging, environmental screening), plus drafting, component engineering, and failure analysis.
• Hands-on support to the team on complex problems, from package design and electrical considerations through failure analysis.
• Developing engineers and building a cross-trained, high-ownership team.
• Partnering across operations, quality, and program management to deliver reliable hardware built on stable processes.

What we're looking for

• Degree in Electrical Engineering strongly preferred. Strong Mechanical Engineers with electromechanical, thermal, packaging, or hybrid microelectronics experience will be considered.
• Engineering leadership experience in hi-rel, hybrid microelectronics, semiconductor, or defense electronics manufacturing.
• Genuine hands-on depth. Someone who still likes to get into the weeds and earn the team's respect technically.
• Breadth across disciplines valued over deep specialization in one area.
• Must be a US person (US citizen or Green Card holder) due to export-control requirements.

Why it's worth a look

• A rare seat with real ownership and cross-disciplinary scope, one step from site leadership.
• Lean, modern operation with strong growth and investment behind it.
• Cross-training culture and the chance to become broadly expert across die and packaging.
• Orlando, FL: no state income tax, strong quality of life, relocation supported.
• Title flexibility for a strong candidate ready to step up.