An application made for this job — a tailored resume and cover letter that speak straight to the posting.
J&T is seeking a Director of Engineering for EMS/PCBA leadership. You will drive engineering strategy, NPI, and document control, partnering with operations, quality, and executives to improve quality, delivery, and profitability.
The role requires 10+ years in EMS with NPI leadership and deep SMT/PCBA expertise, including DFM/DFT, IPC standards, and strong cross-functional influence across customers and suppliers.
Industry: Electronics Manufacturing Services (EMS) / Contract Manufacturing
The Director of Engineering – Electronics Manufacturing Services (EMS / PCBA) provides strategic and operational leadership across the Engineering and Document Control organizations. This executive technical role develops advanced engineering capabilities, spearheads process and capital technology investments, directs New Product Introduction (NPI), and collaborates closely with tier-one customers and suppliers. Partnering across Operations, Quality, Program Management, Supply Chain, and Executive Leadership, the Director ensures all engineering practices drive best-in-class quality, delivery, productivity, unit economics, and client satisfaction.
Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline (or an equivalent combination of education and direct industry experience).
Industry Experience:
Minimum 10+ years of progressive engineering experience within the Electronics Manufacturing Services (EMS) / contract manufacturing industry.
At least 5+ years dedicated to leading New Product Introduction (NPI) and manufacturing process development.
Demonstrated track record leading multi-disciplinary engineering teams in a high-reliability SMT / PCBA environment.
Background in highly regulated sectors (e.g., Aerospace & Defense, Medical Devices, High-Reliability Industrial).
Technical & Process Expertise:
Deep technical command of SMT equipment and line processes: solder paste printing, SPI, high-speed pick-and-place, reflow profiling, AOI, automated X-ray (AXI), wave/selective solder, and rework.
Proven experience with DFM/DFT methodologies, tooling/stencil design, component defect analysis, and testing strategies (ICT, Flying Probe, Functional).
Working knowledge of IPC and J-STD quality standards (IPC-A-610 Class 1–3, J-STD-001); formal IPC certifications preferred.
Hands-on familiarity with PCB design and CAD/CAM software (Valor, Cadence, CAM350, AutoCAD, SolidWorks, or equivalent).
Continuous Improvement & Business Acumen:
Demonstrated success championing Lean / Six Sigma implementations and organizational change; Six Sigma Black Belt certification preferred.
Solid grasp of business finance, capital budgeting, margin preservation, and the financial impact of engineering decisions.
Exceptional executive presentation and interpersonal skills, capable of influencing senior client stakeholders, suppliers, and internal executive teams.
Outstanding analytical reasoning, complex problem solving, and decisiveness in fast-paced manufacturing settings.
Modern, well-lit, climate-controlled manufacturing and engineering office environment.
Compliance with facility Personal Protective Equipment (PPE) standards, including ESD-safe apparel and safety footwear in designated production zones in accordance with OSHA and facility guidelines.