Director of Electrical Engineering

OSI Engineering, Inc.; Palo Alto (CA); Vor Ort; USD 240.000 - 320.000; Vollzeit

Zusammenfassung

OSI Engineering, Inc. is seeking a senior leader to own the electrical engineering team for a breakthrough stealth-stage neurotechnology and brain-computer interface startup.

You will own wearable electrical architecture from schematic through production for an AI-powered neural interface platform featuring a textile beanie with sensors, cameras, RF, and power management. You will lead the EE design, BOM ownership, DFM/DFT, and overseas CM partnerships, mentor engineers, and drive the program to

Qualifikationen

• 10+ years designing complex consumer hardware
• At least one shipped product (wearable, audio, mobile, or comparable)
• Strong SI/PI discipline with hands‑on sign‑off on flex and rigid‑flex multi‑island designs
• Direct experience architecting and validating multi‑MCU communication buses
• Direct experience driving part selection, BOM ownership, and second-source strategy
• Track record of hardware bring‑up and partnering closely with firmware on debug

Aufgaben

• Own the electrical architecture across the platform — compute partitioning, sensor integration, power, RF, and SI/PI.
• Lead schematic and PCB design for flex and rigid-flex multi-island layouts, and own SI/PI sign-off across every revision.
• Architect the power tree — battery management, multi-rail regulation, USB-C charging, and dynamic power budgeting.
• Own RF and wireless electrical design — antenna diversity, body-proximity tuning, and Wi‑Fi/BLE coexistence.
• Define and validate every communication bus on the platform — parallel and serial sensor interfaces, audio buses, inter-MCU links.
• Drive part selection, benchmarking, and BOM ownership across MCUs, PMICs, RF SoCs, and the full electrical BOM, with second-source strategy.
• Lead bring-up at the electrical layer — own SI, PI, power, and bus-level debug, and unblock firmware and subsystem leads on the way.
• Drive the design through DFM and qualification gates with our CMs, and ship the product by end of year.
• Build and lead the EE team as we scale from early test batches to production volumes.

Kenntnisse

Wearable hardware design

Mixed-signal design

MCU systems

Sensor AFEs

Audio DSPs

Image sensor interfaces

RF/wireless

Battery/charging

SI/PI discipline

BOM ownership

Multi-MCU buses

DFM/DFT/ DFA

Tools

CMs

Jobbeschreibung

You’ll own the electrical engineering team for a breakthrough stealth-stage neurotechnology and brain-computer interface (BCI) startup building an AI-powered neural interface platform. In this role, you will own the wearable electrical architecture from schematic through production, helping bring a highly integrated next-generation device to market. The platform combines cameras, spatial audio microphones, EEG sensors, Wi‑Fi/BLE connectivity, and advanced power management on a flex PCB embedded within a textile beanie, requiring deep expertise in compact wearable system design, signal integrity, and production-ready hardware development.

What You’ll Do

• Own the electrical architecture across the platform — compute partitioning, sensor integration, power, RF, and SI/PI.
• Lead schematic and PCB design for flex and rigid-flex multi-island layouts, and own SI/PI sign-off across every revision.
• Architect the power tree — battery management, multi-rail regulation, USB-C charging, and dynamic power budgeting.
• Own RF and wireless electrical design — antenna diversity, body-proximity tuning, and Wi‑Fi/BLE coexistence.
• Define and validate every communication bus on the platform — parallel and serial sensor interfaces, audio buses, inter-MCU links.
• Drive part selection, benchmarking, and BOM ownership across MCUs, PMICs, RF SoCs, and the full electrical BOM, with second-source strategy.
• Lead bring-up at the electrical layer — own SI, PI, power, and bus-level debug, and unblock firmware and subsystem leads on the way.
• Drive the design through DFM and qualification gates with our CMs, and ship the product by end of year.
• Build and lead the EE team as we scale from early test batches to production volumes.

Responsibilities:

• 10+ years designing complex consumer hardware, with at least one shipped product (wearable, audio, mobile, or comparable).
• Deep mixed-signal expertise across MCU systems, sensor AFEs, audio DSPs, image sensor interfaces, RF/wireless, and battery/charging.
• Strong SI/PI discipline with hands‑on sign‑off on flex and rigid‑flex multi‑island designs.
• Direct experience architecting and validating multi‑MCU communication buses — parallel and serial interfaces, inter‑processor links.
• Direct experience driving part selection, BOM ownership, and second‑source strategy on a shipped product.
• Track record of leading hardware bring‑up and partnering closely with firmware on debug.
• Comfortable owning overseas CM relationships and driving DFM, DFT, and DFA from prototype through volume.

Preferred Skills:

• EEG, ECoG, or other biopotential systems — especially high‑channel‑count or dense sensor arrays.
• Custom ASIC bring‑up, silicon co‑design, or in‑array readout architectures.
• RF design for body‑worn antennas and multi‑radio coexistence.
• Founding engineer or lead‑level experience at an early‑stage hardware company.

Diane Chen

408.550.2800 x130