Director / MTS, Heaters and Electrostatic Chuck (ESC)

ASM; Phoenix (AZ); On-site; USD 120,000 - 180,000; Full time

Job summary

ASM, a leader in semiconductor technology, is seeking a senior engineer to design and qualify ESC assemblies and heater systems for 300mm wafer processing. You will define clamping parameters, evaluate dielectric materials, and mitigate contamination risks while coordinating with RF bias and power supply integration in vacuum processing chambers.

The role demands deep experience with ceramic materials, electrostatic clamping, and thermal management, plus hands-on testing with precision

Qualifications

• Master's degree or PhD in Materials Science, Ceramic Engineering, or related discipline.
• 10+ years of experience in semiconductor capital equipment engineering with exposure to ESC or heater technologies.
• Experience with 300mm wafer processing tools and OEM component qualification processes.
• Knowledge of high-purity ceramic fabrication techniques (sintering, plasma spray, anodization).
• Familiarity with reactive process chemistries (fluorine, chlorine plasmas) and their impact on ESC/heater materials
• Solid understanding of electrostatic clamping mechanisms (Coulombic and JR force models) and their process dependencies.
• Experience with ceramic materials and thin-film dielectric systems used in semiconductor equipment.
• Familiarity with thermal management in vacuum environments, including radiation, conduction, and convection heat transfer.
• Hands-on experience with electrical characterization equipment (LCR meters, high-voltage testers, curve tracers).
• Knowledge of plasma processing systems (etch, CVD, PVD, or ALD) and their requirements for ESC performance.
• Experience with FEA thermal simulation tools (ANSYS, COMSOL, or equivalent).
• Strong analytical and problem-solving ability with a systematic approach to failure analysis.
• Effective communication skills and ability to work in cross-functional teams.

Responsibilities

• Design and develop Johnsen-Rahbek (JR) and Coulombic-type ESC assemblies for 300mm wafer processing applications.
• Select and qualify dielectric materials (alumina, AlN, Y2O3) for ESC ceramic layers based on electrical, thermal, and chemical compatibility requirements.
• Define ESC clamping voltage, leakage current, and chucking / dechucking performance specifications.
• Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage across process temperature ranges.
• Analyze and mitigate wafer backside contamination, particle generation, and arcing risks associated with ESC operation.
• Support ESC integration with RF bias and DC chucking power supplies in plasma processing chambers.
• Design multi-zone embedded heater assemblies for uniform wafer temperature distribution across process temperatures (room temperature to 700°C+).
• Perform thermal modeling and simulation (FEA) to optimize heater layout, power density, and zone configuration.
• Develop and validate closed-loop temperature control systems including thermocouple/RTD sensor selection and PID control tuning.
• Characterize heater uniformity, ramp rates, and thermal response using wafer-level temperature mapping tools.
• Manage thermal stress and CTE mismatch between heater, ceramic, and base plate materials to ensure long‑term reliability

Skills

semiconductor equipment experience

300mm wafer tooling

high-purity ceramic fabrication

reactive chemistries

electrostatic clamping knowledge

ceramic materials & thin-film dielectr

thermal management in vacuum

analytical & problem solving

cross-functional collaboration

Education

Master's or PhD in Materials Science / Ceramic Engineering

Tools

LCR meters

High-voltage testers

Curve tracers

ANSYS

COMSOL

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Key Responsibilities

• Design and develop Johnsen-Rahbek (JR) and Coulombic-type ESC assemblies for 300mm wafer processing applications.
• Select and qualify dielectric materials (alumina, AlN, Y2O3) for ESC ceramic layers based on electrical, thermal, and chemical compatibility requirements.
• Define ESC clamping voltage, leakage current, and chucking / dechucking performance specifications.
• Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage across process temperature ranges.
• Analyze and mitigate wafer backside contamination, particle generation, and arcing risks associated with ESC operation.
• Support ESC integration with RF bias and DC chucking power supplies in plasma processing chambers.
• Design multi-zone embedded heater assemblies for uniform wafer temperature distribution across process temperatures (room temperature to 700°C+).
• Perform thermal modeling and simulation (FEA) to optimize heater layout, power density, and zone configuration.
• Develop and validate closed-loop temperature control systems including thermocouple/RTD sensor selection and PID control tuning.
• Characterize heater uniformity, ramp rates, and thermal response using wafer-level temperature mapping tools.
• Manage thermal stress and CTE mismatch between heater, ceramic, and base plate materials to ensure long‑term reliability

Required Qualifications

• Master's degree or PhD in Materials Science, Ceramic Engineering, or related discipline.
• 10+ years of experience in semiconductor capital equipment engineering, with direct exposure to ESC or heater technologies.
• Experience with 300mm wafer processing tools and OEM component qualification processes.
• Knowledge of high‑purity ceramic fabrication techniques (sintering, plasma spray, anodization).
• Familiarity with reactive process chemistries (fluorine, chlorine plasmas) and their impact on ESC/heater materials
• Solid understanding of electrostatic clamping mechanisms (Coulombic and JR force models) and their process dependencies.
• Experience with ceramic materials and thin‑film dielectric systems used in semiconductor equipment.
• Familiarity with thermal management in vacuum environments, including radiation, conduction, and convection heat transfer.
• Hands‑on experience with electrical characterization equipment (LCR meters, high‑voltage testers, curve tracers).
• Knowledge of plasma processing systems (etch, CVD, PVD, or ALD) and their requirements for ESC performance.
• Experience with FEA thermal simulation tools (ANSYS, COMSOL, or equivalent).
• Strong analytical and problem‑solving ability with a systematic approach to failure analysis.
• Effective communication skills and ability to work in cross‑functional teams.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what's possible through cutting‑edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.