DIRECTOR, FCCSP BUSINESS UNIT

Semiconductor Engineering; Tempe (AZ); Hybrid; USD 140,000 - 190,000; Full time

Job summary

Amkor is seeking a Product Engineer/Manager with IC package development and business acumen, emphasizing fcCSP technologies across high-performance, automotive, and related package types. This role leads product development, pricing, NPI, and customer negotiations from inception through qualification and production.

Based in Tempe, AZ with a hybrid schedule, the position collaborates with customers and factory teams to translate requirements into reliable, cost-optimized package solutions and

Qualifications

• Bachelor’s degree in mechanical, chemical, materials, or electrical engineering.
• 10+ years in the semiconductor industry.
• Experience in a technical/business capacity within manufacturing or distribution in semiconductor packaging.
• Strong project management across offshore factories and matrixed organizations.
• Independent, self-driven, able to multitask and own program success.
• Excellent communication and presentation skills across levels and functions.
• Proficiency in Excel, PowerPoint, and MS Office.
• Experience with customer relationships or supplier management.

Responsibilities

• Work with customer teams to understand assembly, reliability and scheduling requirements for new configurations and introductions.
• Apply knowledge of semiconductor packaging and substrate technologies to concurrent NPI programs.
• Promote package technologies to customers to identify applications and drive business.
• Create package/process risk assessments and implement mitigation plans to control costs.
• Develop cost analyses for package types, processes, RFQs, and provide pricing inputs to management and sales.
• Establish and maintain supply chains from bumping through final test.

Skills

Project Management

Communication skills

Excel

PowerPoint

MS Office

Customer engagement

Negotiation

Education

Bachelor's Degree in Mechanical/Electrical/Chemical/Materials Engineering

Tools

MS Office Suite

Job description

Position SummaryAmkor is seeking a Product Engineer/Manager preferably with experience in IC package development / business acumen, with an emphasis on fcCSP technologies across the various package types (high performance computing, Grade 0, 1, 2 & Grade 3 Automotive for autonomous driving and cabin infotainment.) These are advanced flip-chip packages with leading edge thermal / mechanical / electrical requirments. This position will manage the product development, business strategy, pricing/cost controls, NPI engineering, and customer negotiations from inception through final product qualification and production. This position is based in the Amkor corporate office in Tempe, AZ.

• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions.
• Daily application of knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development / New Product Introduction (NPI) programs.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work with factory teams to create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Create and maintain detailed cost analysis on package types, process flows, and customer product Request for Quotes (RFQs) as well as provide detailed pricing inputs to management and sales on customer package engineering programs.
• Establish/maintain supply chains from beginning to end in packaging field (bumping, probe test, assembly, and final test).

Position SummaryAmkor is seeking a Product Engineer/Manager preferably with experience in IC package development / business acumen, with an emphasis on fcCSP technologies across the various package types (high performance computing, Grade 0, 1, 2 & Grade 3 Automotive for autonomous driving and cabin infotainment.) These are advanced flip-chip packages with leading edge thermal / mechanical / electrical requirments. This position will manage the product development, business strategy, pricing/cost controls, NPI engineering, and customer negotiations from inception through final product qualification and production. This position is based in the Amkor corporate office in Tempe, AZ.Essential Duties And Responsibilities

• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions.
• Daily application of knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development / New Product Introduction (NPI) programs.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work with factory teams to create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Create and maintain detailed cost analysis on package types, process flows, and customer product Request for Quotes (RFQs) as well as provide detailed pricing inputs to management and sales on customer package engineering programs.
• Establish/maintain supply chains from beginning to end in packaging field (bumping, probe test, assembly, and final test).

Required Qualifications

• This position requires at least a Bachelor’s Degree in related Engineering field (Mechanical, Chemical, Materials, Electrical engineering) in addition to at least 10-years experience in the semiconductor industry.
• Relevant experience in a technical / business capacity in the manufacturing, distribution industries within semiconductor industry; knowledge in semiconductor packaging is preferred.
• Exhibit extremely organized technical Project Management experience (preferably, involving off-shore factories) and the ability to multiplex across numerous programs and teams is essential.
• Demonstrated ability to work independently in a heavily matrixed organization. Needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role, assuming ownership of program success is a must.
• Strong technical background with strong problem-solving skills required.
• Prior experience with supplier relationships or customer facing program management experience.
• Demonstrated ability to work independently, self-motivated and perform hands on engineering tasks.
• Proficiency in Excel, PowerPoint, and other MS Office software.
• Excellent communication and presentation skills, across levels, including working across functional groups as well as cross-culturally.

Preferred Qualifications

• Industrial Engineering course study / factory experience beneficial.
• Exposure to substrate process technology is preferred.
• Experience in working with diverse teams in Southeast Asia.
• Experience/knowledge with mechanical test, material property test, reliability test, failure analysis.
• Experience with cost modeling, pricing, quoting activities and products.
• Ability to work in a world-wide diverse work environment across multiple time zones.

Location:Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered. Please note: This position may require access to export-controlled information. Candidate must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) or be eligible to qualify for a U.S. Government export authorization. Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.