DIRECTOR, CHIPLETS/FCBGA INTEGRATION

Semiconductor Engineering; Tempe (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor is seeking a Director, Chiplets and FCBGA in Tempe, AZ to lead program management for advanced chiplet-based IC packages, coordinating with Tier 1 customers and Amkor's R&D center in Korea.

You will drive development activities across R&D, Design, Characterization and Simulation teams, guiding production ramp and customer interactions through the development lifecycle.

Qualifications

• Bachelor's degree in Engineering; Mechanical or Materials preferred. Master’s degree a plus.
• 10+ years of experience in semiconductor package development; direct IC packaging experience required.
• Understanding of IC package design environment and tradeoffs during process development of FCBGA packages.
• Working knowledge of mechanical stress/strain and IC package warpage.
• Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures.
• Excellent written and verbal communication skills.
• Willingness to travel 10–20% (domestic and international).

Responsibilities

• Drive and coordinate development activities with customers and R&D teams.
• Lead Tier 1 customer interface meetings during project development.
• Manage cross-functional team to execute projects in a timely manner (R&D, Design, Characterization, Simulation).
• Manage customer product management through development and initial production ramp.

Skills

Semiconductor packaging

IC packaging

Mechanical stress/strain

Warpage knowledge

Communication skills

Travel willingness

Education

Bachelor's degree in Engineering (Mechanical or Materials preferred)

Master's degree a plus

Tools

Mechanical/thermal simulation

Job description

Position Summary

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea.

• Drive and coordinate development activities with customers, in conjunction with Amkor’s R&D development teams in Korea.
• Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
• Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
• Manage customer product management through the development phase and into initial production ramp.

Position Summary

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea.

Essential Duties And Responsibilities

• Drive and coordinate development activities with customers, in conjunction with Amkor’s R&D development teams in Korea.
• Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
• Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
• Manage customer product management through the development phase and into initial production ramp.

Required Qualifications

• Bachelor’s Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master’s degree is a plus.
• 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
• The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
• A working knowledge of mechanical stress/strain and IC package warpage is required.
• Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
• Excellent written and verbal communication skills are needed.
• This position requires 10-20% travel including domestic and international travel.

Preferred Qualifications

• Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
• Mechanical or Thermal simulation experience.
• Familiarity with Design of Experiments and Statistical Process Control.

Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.