Direct Liquid Cooling Infrastructure Product Manager

Hewlett Packard Enterprise

Spring (TX)

Hybrid

USD 110,000 - 253,000

Full time

9 days ago

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Benefits offered by this job

Health & Wellbeing benefits
Professional development programs
Inclusive culture

Job summary

Hewlett Packard Enterprise seeks a Product Manager to lead strategy, definition, and lifecycle of Compute’s direct liquid cooling infrastructure portfolio. You will define solutions spanning servers, racks, CDUs, manifolds, cold plates, and associated systems, working across engineering, supply chain, and sales to deliver scalable, high-density AI infrastructure.

The role supports a hybrid work model with an average of two days per week in an HPE office, and requires strong leadership,

Qualifications

  • 5+ years of experience in product management or related roles within enterprise infrastructure.
  • Demonstrated understanding of data-center cooling and thermal-management technologies, including direct liquid-cooling architectures, cold plates, manifolds, CDUs, facility water loops.

Responsibilities

  • Define the product strategy and multi-generation roadmap for direct liquid-cooling infrastructure across servers, racks, CDU, manifolds, and related subsystems.
  • Translate customer and market requirements into clear specifications to drive scalable, modular solutions.
  • Lead cross-functional development with engineering, supply chain, operations, sales, and services to deliver high-density AI infrastructure.
  • Align GPU/CPU power, rack density, and facility infra with cooling capacity for AI workloads.
  • Build and manage partner ecosystems across liquid-cooling tech, CDUs, cold plates, and related subsystems.

Skills

Direct liquid cooling
AI/accelerated computing
Thermal management
Cross-functional leadership
Vendor management

Education

Bachelor’s degree in engineering/computer science or related field
Advanced degree preferred

Tools

ORV3/Open Rack familiarity

Job description

Direct Liquid Cooling Infrastructure Product Manager

This role has been designed as 'Hybrid' with a requirement that you will work on average 2 days per week from an HPE office.

Who We Are

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description

HPE is seeking a highly motivated and technically skilled Product Manager to lead the strategy, product definition, and lifecycle management of Compute’s direct liquid cooling infrastructure portfolio. As AI, accelerated computing, and HPC drive rack power densities beyond the capabilities of traditional air cooling, direct liquid cooling is becoming essential to high-density data-center infrastructure. In this role, you will define solutions spanning servers, racks, cooling distribution units, cold plates, manifolds, facility water systems, monitoring, and control technologies. You will work cross-functionally with engineering, supply chain, operations, sales, services, finance, and strategic partners to develop scalable, commercially viable solutions that enable customers to deploy dense AI and accelerated-computing systems.

Key Responsibilities
  • Define the product strategy and multi-generation roadmap for HPE direct liquid-cooling infrastructure, addressing AI, increasing rack power densities, and evolving customer and market needs.
  • Establish the portfolio and product requirements across liquid-cooled for servers, racks, CDUs, manifolds, cold plates, controls, monitoring, telemetry, leak detection, serviceability, deployment, maintenance, upgrades, and lifecycle management.
  • Lead integrated product development by translating customer, competitive, technology, and industry requirements into clear specifications, driving scalable, modular, and interoperable solutions across servers, racks, facility cooling systems, and data-center infrastructure.
  • Enable high-density AI and accelerated-computing architectures by aligning GPU and CPU power, rack density, facility infrastructure, and cooling capacity, including integration with ORV3 and next-generation rack platforms.
  • Build and manage the ecosystem of partners across liquid-cooling technologies, CDUs, cold plates, facility infrastructure, and related subsystems, while coordinating closely with Compute, Data Center Rack & Infrastructure, and Portfolio Planning teams and participating in relevant industry standards.
  • Drive go-to-market execution through product positioning, messaging, pricing, competitive differentiation, sales and marketing enablement, strategic customer engagements, business cases, financial models, and ongoing analysis of market adoption and competitive trends.
  • Own portfolio and business performance throughout the lifecycle by managing revenue, margin, attach rate, adoption, customer satisfaction, configuration strategy, lifecycle decisions, building blocks reuse, and standardization across HPE’s server and rack portfolio.
Requirements
  • Bachelor’s degree in engineering, computer science, business, or a related technical field; or equivalent work experience, an advanced degree is preferred. Typically, 5+ years of experience in product management, product marketing, systems engineering, or a related role within enterprise infrastructure. Demonstrated understanding of data-center cooling and thermal-management technologies, including direct liquid-cooling architectures, cold plates, manifolds, CDUs, facility water loops, secondary cooling loops, and heat exchangers.
  • Experience with server, rack, data-center, AI, or other high-density computing infrastructure, including AI/GPU platforms.
  • System-level understanding of the relationship among compute, power, thermal management, cooling capacity, and data-center infrastructure, including rack power densities above 50 kW and emerging 100 kW+ AI racks.
  • Familiarity with ORV3/Open Rack or similar architectures; relevant industry standards such as ASHRAE, OCP, Open19, and ORV3; and topics including water chemistry and liquid-cooling distribution.
  • Strong analytical, financial, business-planning, communication, and cross-functional leadership skills, with the ability to translate technical requirements into customer and business value.
  • Experience managing strategic technology suppliers and ecosystem partners and taking complex infrastructure products from concept through commercial launch, including collaboration with accelerator-platform providers such as AMD, Intel, or NVIDIA.
Knowledge and Skills
  • Ability to lead through influence and collaborate effectively across engineering, operations, supply chain, sales, services, finance, marketing, and other functions.
  • Experience managing strategic suppliers, developing technology and ecosystem partnerships, engaging customers, and communicating with executive stakeholders.
  • Knowledge of direct-to-chip liquid cooling, facility water systems, CDU architectures, secondary cooling loops, water chemistry, liquid-cooling distribution, monitoring, controls, and leak detection.
  • Understanding of rack power densities exceeding 50 kW, emerging 100 kW-plus AI racks, and the associated thermal-management and facility-infrastructure requirements.
  • Knowledge of ORV3/Open Rack, Open19, ASHRAE, OCP, or comparable data-center infrastructure standards.
  • Experience ensuring interoperability across servers, racks, cooling systems, facility infrastructure, and related data-center components.
  • Ability to translate complex technical requirements into business value, align value-chain partners, and support product strategy, roadmap development, and lifecycle execution.
Accessibility

Accessibility HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here. Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

What We Can Offer You
  • Health & Wellbeing We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.
  • Personal & Professional Development We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.
  • Unconditional Inclusion We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html

Job

Engineering Job Level: TCP_03

United States of America: Annual Salary USD 110,000 - 253,000 in Texas The listed salary range reflects base salary. Variable incentives may also be offered.

Equal Opportunity Employer (EEO)

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together.

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

HPE is an E-Verify Employer

HPE is an E-Verify employer. E-Verify is an Internet-based system that compares information from an employee's Form I-9, Employment Eligibility Verification, to data from the U.S. Department of Homeland Security and Social Security Administration records to confirm the employment eligibility of all newly hired employees. For more information click here.

Standards of Business Conduct (SBC)

The Hewlett Packard Enterprise Standards of Business Conduct (SBC) embody the fundamental principles that govern our ethical and legal obligations to Hewlett Packard Enterprise. They pertain not only to our conduct within the company but also to conduct involving our customers, channel partners, suppliers and competitors. Read more about how we win the right way.

We Are In the Acceleration Business

We help customers use technology to slash the time it takes to turn ideas into value. In turn, they transform industries, markets and lives. Some of our customers run traditional IT environments. Most are transitioning to a secure, cloud-enabled, mobile-friendly infrastructure. Many rely on a combination of both. Wherever they are in that journey, we provide the technology and solutions to help them succeed.

Disclosure of Sensitive Personal Data

Please ensure the resume you submit to us does not include any sensitive personal data. Sensitive personal data includes data revealing information about your racial or ethnic origin, political opinions, religious or philosophical beliefs, trade union membership, health, sex life or sexual orientation. To the extent the resume you submit does contain this type of personal data, you consent to the storing and processing of this data by HPE for the purpose of reviewing and managing your application.

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