Digital IC Design Intern: Shape Next-Gen Chips

Texas Instruments

Bouchard (TX)

Sur place

USD 28 000 - 41 000

Plein temps

14 jours+
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Résumé du poste

Texas Instruments is seeking a Digital IC Design Engineering Intern to help architect and deliver advanced ICs across analog, digital, and RF domains. You will work with business teams, system engineers, and test/product teams to define specifications, analyze trade-offs, and document designs.

The role includes participation in reviews and layout coordination to ensure high performance at a competitive cost.

Responsabilités

  • Partnering with business teams and system engineering to develop mutually agreeable design specifications
  • Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost
  • Participating in design reviews and creating the necessary design and product documentation
  • Partnering on IC layouts to ensure a high-performance standard
  • Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases
  • Driving behavioral models

Description du poste

Texas Instruments is seeking a Digital IC Design Engineering Intern to help architect and deliver advanced ICs across analog, digital, and RF domains. You will work with business teams, system engineers, and test/product teams to define specifications, analyze trade-offs, and document designs.

The role includes participation in reviews and layout coordination to ensure high performance at a competitive cost.

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