Digital IC Design Engineering Intern: Shape Next-Gen Chips

Texas Instruments; Bouchard (TX); On-site; USD 28,000 - 36,000; Full time

Job summary

Texas Instruments is seeking a Digital IC Design Engineering intern in the United States. You will architect analog, digital, and RF ICs, define, design, model, implement and document.

The role spans areas like audio, imaging, high-speed, interface, clocking, automotive, power, and more. You will partner with business teams and system engineering to develop design specifications, analyze architecture trade-offs, participate in design reviews, and drive prototypes and test development toward

Responsibilities

• Partnering with business teams and system engineering to develop mutually agreeable design specifications
• Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost
• Participating in design reviews and creating the necessary design and product documentation
• Partnering on IC layouts to ensure a high-performance standard
• Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases
• Driving behavioral models

Skills

Digital IC design

Analog IC design

RF IC design

Test specification

Design reviews

Job description

Texas Instruments is seeking a Digital IC Design Engineering intern in the United States. You will architect analog, digital, and RF ICs, define, design, model, implement and document.

The role spans areas like audio, imaging, high-speed, interface, clocking, automotive, power, and more. You will partner with business teams and system engineering to develop design specifications, analyze architecture trade-offs, participate in design reviews, and drive prototypes and test development toward