Digital IC Design Engineering Intern - MS/PhD

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 28,000 - 41,000; Full time

Job summary

118-WW TMG MFG OPS is offering a Digital IC Design Engineering Intern position in Dallas, TX. You will help architect analog, digital, and RF ICs, and define, model, implement, and document designs across many domains including audio, imaging, and automotive contexts.

The internship emphasizes collaboration with cross-functional teams, rigorous design reviews, and documentation to drive product releases while developing high-performance, cost-effective IC solutions.

Qualifications

• Pursuing a Master’s degree in Electrical or Computer Engineering or a related field.
• GPA 3.0/4.0 or higher.

Responsibilities

• Partner with business teams and system engineering to develop mutually agreeable design specifications.
• Provide high-level analysis on chip architecture trade-offs to balance performance and cost.
• Participate in design reviews and create necessary design and product documentation.
• Partner on IC layouts to ensure a high-performance standard.
• Characterize prototypes, develop test specifications and coordinate with test/product engineering to drive product releases.
• Drive behavioral models.

Skills

Relationship building

Verbal and written comms

Team collaboration

Initiative and drive

Time management

Analytical problem solving

Adaptability & ramp-up

Education

Master’s degree in Electrical or Computer Engineering or related field

Job description

Change the world. Love your job.

As a Digital IC Design Engineering intern, you'll architect new TI products and make our customers' visions a reality. You'll define, design, model, implement and document analog, digital, and RF integrated circuits (ICs). And, you'll have the opportunity to work in exciting areas like audio, imaging, high-speed, interface, clocking, medical, high volume linear, automotive, storage, power supply, battery management, linear power and many more.

• Partnering with business teams and system engineering to develop mutually agreeable design specifications


• Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost


• Participating in design reviews and creating the necessary design and product documentation


• Partnering on IC layouts to ensure a high-performance standard


• Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases


• Driving behavioral models

Put your talent to work with us as a Digital IC Design Engineer Intern!

Minimum Requirements:

• Currently pursuing a Master's degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering or related field


• Cumulative 3.0/4.0 GPA or higher

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally


• Strong verbal and written communication skills


• Ability to quickly ramp on new systems and processes


• Demonstrated strong interpersonal, analytical and problem-solving skills


• Ability to work in teams and collaborate effectively with people in different functions


• Ability to take the initiative and drive for results


• Strong time management skills that enable on-time project delivery