Analog IC Design Engineering Intern - MS/PhD

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 28,000 - 41,000; Full time

Job summary

As an analog IC design engineering intern, you will architect new IC products and make customers' visions a reality. You will define, design, model, implement and document analog, digital, and RF integrated circuits, with opportunities across areas like audio, imaging, high-speed, and automotive.

Minimum requirements include pursuing a graduate degree in Electrical Engineering, Computer Engineering, or Electrical & Computer Engineering and a GPA of 3.0 or higher.

Qualifications

• Pursuing a graduate degree in Electrical Engineering, Computer Engineering or Electrical & Computer Engineering.
• GPA of 3.0/4.0 or higher.

Responsibilities

• Partner with business teams and system engineering to develop design specifications.
• Provide high-level analysis on chip architecture trade-offs for spec compliance and performance at a competitive cost.
• Participate in design reviews and create design/product documentation.
• Supervise IC layouts to meet high-performance standards.
• Characterize prototypes, develop test specs, and coordinate with test/product engineering to drive releases.
• Drive behavioral models.

Skills

Communication

Team collaboration

Problem solving

Time management

Adaptability

Education

Graduate degree in Electrical/Computer Engineering

Job description

Change the world. Love your job.

As a analog IC design engineering intern, you'll architect new TI products and make our customers' visions a reality. You'll define, design, model, implement and document analog, digital, and RF integrated circuits (ICs). And, you'll have the opportunity to work in exciting areas like audio, imaging, high-speed, interface, clocking, medical, high volume linear, automotive, storage, power supply, battery management, linear power and many more.

Some of your responsibilities will include, but will not be limited to:

• Partnering with business teams and system engineering to develop mutually agreeable design specifications
• Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost
• Participating in design reviews and creating the necessary design and product documentation
• Supervising IC layouts to ensure a high-performance standard
• Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases
• Driving behavioral models

Put your talent to work with us as a Design Engineer Intern!

Minimum requirements:

• Currently pursuing a graduate degree in Electrical Engineering, Computer Engineering or Electrical & Computer Engineering
• Cumulative 3.0/4.0 GPA or higher

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery