Device & Process Integration Engineer - Analog & Embedded

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 90,000 - 130,000; Full time

Job summary

Texas Instruments is seeking an energetic Device and Process Integration Engineer to drive improvements in process and device performance for a state-of-the-art 300mm analog and embedded wafer fab in Lehi, Utah.

The role requires strong analytical and problem-solving skills, excellent written and verbal communication, and effective collaboration across functions to meet tight schedules and ambitious goals.

Qualifications

• Bachelor's degree in the listed fields is required.
• Experience in semiconductor device/process integration is preferred.
• Strong cross-functional communication and leadership abilities are expected.

Responsibilities

• Utilize semiconductor device physics knowledge to enable competitive technology through process and parametric improvements.
• Drive process and device improvements through characterization, DOE, data analysis and simulation.
• Own technology parametric performance.

Skills

Analytical skills

Problem solving

Communication skills

Teamwork

Time management

Relationship building

Adaptability

Initiative

Education

Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field

Job description

Texas Instruments is seeking an energetic Device and Process Integration Engineer to drive improvements in process and device performance for a state-of-the-art 300mm analog and embedded wafer fab in Lehi, Utah.

The role requires strong analytical and problem-solving skills, excellent written and verbal communication, and effective collaboration across functions to meet tight schedules and ambitious goals.