DCP Equipment Engineering Intern - Summer 2027 - nxp

OpenTalent; Austin (TX); On-site; USD 28,000 - 41,000; Full time

Job summary

NXP's ATMC wafer manufacturing facility in the United States is offering a Summer Engineering internship. The program runs about 12 weeks and provides an introduction to semiconductor manufacturing, technology and operations.

Interns will work with an experienced engineer mentor to troubleshoot production equipment and process issues, drive real projects that impact safety, quality, delivery and cost, and present results to factory senior management at the internship's end.

Qualifications

• Currently pursuing a BS in mechanical, materials science, chemical or electrical engineering.
• Interest in the semiconductor industry.
• Strong verbal and written communication skills.
• Good problem-solving skills.
• Self-motivated; able to take initiative and work with a mentor.
• Excellent interpersonal skills.

Responsibilities

• Troubleshoot production equipment and processes with a mentor.
• Drive real projects impacting Safety, Quality, Delivery or Cost.
• Present results to factory senior management at the internship end.
• Equipment engineering will optimize multi-million dollar production equipment.
• Process engineering will optimize manufacturing steps.

Skills

Communication

Problem-solving

Self-motivation

Interpersonal skills

Mentor collaboration

Education

Pursuing BS in Engineering

Job description

Job Summary:

Summer Engineering internship at NXP’s ATMC wafer manufacturing facility

Approximately 12 weeks long

Learn the basics of semiconductor manufacturing, technology and operations

Work with an experienced engineer mentor to troubleshoot production equipment and process issues within the factory

Drive one or more real projects urgently needed by the fab related to key business metrics (Safety, Quality, Delivery, Cost)

Deliver real results to the business and present to factory senior management at the end of the internship

Equipment engineering will optimize the multi-million dollar production equipment (parts, preventative maintenance, cleaning and repair, etc.)

Process engineering will optimize the processes (materials, time, temperature, dose, etc.) of the various manufacturing steps

Key Challenges:

• Integrating tool improvements across multiple tool types with different operating systems


• Coordinating multiple activities with shared / limited resources

Cross functional aspects:

Work with cross functional teams (Process Engineers, Equipment Engineers, Operations, Facilities, etc) to accomplish testing, improving tool performance, tool installs, tool removals, tool moves.

Job Qualifications:

• Must be currently working towards a BS in Engineering (Mechanical, Materials Science, Chemical or Electrical Engineering preferred)


• A desire to learn about the semiconductor industry.


• Strong verbal and written communication skills.


• Good problem-solving skills.


• Self-motivated; able to take initiative and work with a mentor.


• Excellent interpersonal skills.

In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.