Cross-Functional System Design Engineer

Socket.dev

Cupertino (CA)

On-site

USD 185,000 - 278,000

Full time

3 days ago
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Job summary

Apple Inc. in Cupertino, California, seeks a Mechatronic/Mechanical engineer to collaborate with design, hardware, and software teams to refine consumer electronics product architectures. You will perform FEA, develop physics models, and support design optimization through rapid prototyping.

The role emphasizes manufacturability, material selection, and cross-disciplinary integration across mechanical, electrical, RF, and thermal subsystems.

Qualifications

  • Bachelor's degree or foreign equivalent in Mechatronic Engineering, Mechanical Engineering, or related field.
  • Experience with Finite Element Analysis using Abaqus or ANSYS to evaluate structural integrity and design optimization.
  • Ability to build physics-based analytical models and rapid assessment frameworks for concept feasibility.

Responsibilities

  • Collaborate with industrial design, product integrity, hardware, software, and technology teams to refine and execute on product design.
  • Develop initial product layouts and generate concepts for evaluation.
  • Simulate behavior, prototype, and test to drive down-selection and optimize manufacturability.
  • Partner with external vendors and internal manufacturing teams to ensure designs meet functional and cosmetic requirements throughout lifecycle.

Skills

FEA
Abaqus
ANSYS
CAD (NX)
nTopology
DOE
Prototype fabrication
Data visualization

Education

Bachelor's Degree in Mechatronic Engineering, Mechanical Engineering, or related field

Tools

Abaqus
ANSYS
NX
nTopology

Job description

Apple Inc. in Cupertino, California, seeks a Mechatronic/Mechanical engineer to collaborate with design, hardware, and software teams to refine consumer electronics product architectures. You will perform FEA, develop physics models, and support design optimization through rapid prototyping.

The role emphasizes manufacturability, material selection, and cross-disciplinary integration across mechanical, electrical, RF, and thermal subsystems.

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