Cross-Domain Electronics Systems Prototyping Intern

Siemens Digital Industries Software; Detroit (MI); Hybrid; USD 25,000 - 69,000; Full time

Benefits offered by this job

Mentorship

Career development

Networking

Workshops

Leadership opportunities

Volunteer time off

Employee discounts

Job summary

Siemens Industry Software Inc. is seeking an Cross-Domain Electronic Systems Engineering Intern to contribute to a reference silicon-to-rack product development workflow that integrates EDA, PLM, and AI technologies across IC design, packaging, PCB, mechanical, and PLM domains.

The internship spans multiple engineering disciplines and aims to showcase an end-to-end digital thread. The role emphasizes exploring AI-enabled workflows, prototyping software, and learning industry tools in a

Qualifications

• Pursuing a Bachelor's, Masters, or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, Electronics Engineering, or related STEM field
• Strong analytical and problem-solving skills
• Excellent verbal and written communication skills
• Ability to learn quickly and work independently
• Self-motivated, curious, and adaptable

Responsibilities

• Research and evaluate emerging engineering technologies and workflows
• Develop software prototypes, automation tools, and proof-of-concept solutions
• Explore digital, analog, semiconductor, PCB, and system-level design concepts
• Document technical findings through white papers, tutorials, and technical guides
• Investigate AI-assisted engineering and documentation workflows
• Learn and utilize industry-leading EDA and PLM tools
• Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment

Skills

C++ development

Python development

Analytical skills

Communication skills

Independent learner

Education

Bachelor's/Master's/PhD in EE/CE/CS or related STEM

Tools

Python

C++

Linux

Job description

Siemens Industry Software Inc. is seeking an Cross-Domain Electronic Systems Engineering Intern to contribute to a reference silicon-to-rack product development workflow that integrates EDA, PLM, and AI technologies across IC design, packaging, PCB, mechanical, and PLM domains.

The internship spans multiple engineering disciplines and aims to showcase an end-to-end digital thread. The role emphasizes exploring AI-enabled workflows, prototyping software, and learning industry tools in a