CLAWS Packaging Engineer

North Carolina State University; Raleigh (NC); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, Dental, and Vision insurance

Flexible Spending Account

Retirement Programs

Tuition Assistance

Paid Time Off

Job summary

A public research university in Raleigh, NC, is seeking a Packaging Engineer to support the development of advanced RF and photonic devices. The role involves designing packaging processes and collaborating with cross-functional teams to enhance performance and manufacturability. Candidates should have a relevant advanced degree and experience in high-power or RF applications, alongside strong communication skills. The position offers comprehensive benefits, including health insurance and retirement plans.

Qualifications

• Ph.D. or terminal degree in a relevant field required.
• Experience in high-power, RF, or photonics applications desired.
• Comfort collaborating with diverse groups.

Responsibilities

• Support developing RF and photonic devices packaging.
• Lead development of processes for packaging.
• Collaborate with circuit designers and development teams.

Skills

Experience designing packaging processes

Excellent communication skills

Ability to multitask

Collaboration skills

Education

Ph.D. in Electrical Engineering

Master’s with 5 years experience

Bachelor’s with 8 years experience

Tools

DOE tools

SPC systems

JMP

Minitab

Job description

Job Title & Location

CLAWS Packaging Engineer – Raleigh, NC – Monday – Friday 8:00 AM to 5:00 PM

Essential Job Duties

The engineer will support the development of advanced RF, power, and photonic devices and integrated circuits by designing and integrating packaging processes. Responsibilities include defining interconnect strategies, performing thermal and mechanical analysis, and ensuring compatibility with wafer‑level processes and test infrastructure.

Lead Packaging of Wide Bandgap Semiconductor Devices (30%)

• RF devices including HEMTs and MMICs
• High‑power electronic devices including HEMTs, FETs, and diodes
• Visible‑spectrum optoelectronic devices and photonic integrated circuits

Packaging Design and Assembly Workflows (25%)

• Specify package solutions that meet performance requirements of new technology platforms with CLAWS teams
• Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules
• Participate in cross‑functional design initiatives that improve performance, manufacturability, yield, or reliability

Process Integration (25%)

• Lead the development and integration of processes such as die attach, wire bonding, and encapsulation
• Analyze package and module performance; inform electrical, thermal, and mechanical simulations with design and characterization data
• Troubleshoot process integration challenges related to defectivity, yield, and reliability

Cross‑Functional Collaboration (20%)

• Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system‑level advantages
• Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks

Other Responsibilities

• Comply with stated workplace policies
• Communicate results, plans, and other updates to a variety of audiences
• Adhere to and mentor others in known best practices
• Support CLAWS activities such as tours, meetings, and conferences

Qualifications

Minimum Education and Experience:

• Ph.D. or terminal degree in Electrical Engineering, Materials Science, or related field with focus on high power, RF, or photonics devices; or
• Master’s degree with at least 5 years of experience in high‑power, RF, or photonics device packaging and process integration; or
• Bachelor’s degree with at least 8 years of experience in high‑power, RF, or photonics device packaging and process integration

Other Required Qualifications:

• Experience designing and implementing packaging processes for high‑power, RF, or photonics applications
• Excellent communication and interpersonal skills
• Ability to multitask and meet deadlines with moderate supervision
• Ability to follow safe procedures for semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders
• Comfort collaborating with students, faculty, and staff of varying experience and backgrounds
• Eligibility to obtain U.S. government clearance upon request

Preferred Qualifications:

• Modeling thermal, electrical, or mechanical behavior in packaged devices
• Characterization of devices and processes, including failure analysis and defect inspection
• RF or optical signal integrity
• Advanced packaging architectures
• Design for reliability and reliability testing
• MES and SPC systems
• Statistical methods (e.g., DOE, GR&R) and tools (e.g., JMP, Minitab)
• Material specification and vendor management

Benefits

• Medical, Dental, and Vision insurance
• Flexible Spending Account
• Retirement Programs
• Disability Plans
• Life Insurance
• Accident Plan
• Paid Time Off and Other Leave Programs
• 12 Holidays Each Year
• Tuition Assistance
• Childcare benefits
• Wellness & Recreation Membership, Wellness Programs

Equal Opportunity Employer

NC State University is an equal opportunity employer. All qualified applicants will receive equal opportunities for employment without regard to age, color, disability, gender identity, genetic information, national origin, race, religion, sex (including pregnancy), sexual orientation, and veteran status. The University encourages all qualified applicants, including protected veterans and individuals with disabilities, to apply. Individuals with disabilities requiring disability‑related accommodations in the application and interview process are welcome to contact 919‑513‑0574 to speak with a representative of the Office of Equal Opportunity.

NC State University participates in E‑Verify. Federal law requires all employers to verify the identity and employment eligibility of all persons hired to work in the United States.