Board Engineer, Senior Staff

Qualcomm Incorporated; San Diego (CA); On-site; USD 170,000 - 255,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a senior hardware design engineer to design and document PCB layouts for reference and production platforms, collaborating with Data Center and compute teams globally.

You will work on high-speed multi-layer boards, RF and power delivery networks, and engage with suppliers for fabrication and assembly. The role requires proficiency in Xpedition/Allegro, experience with HDI packaging, and a track record of delivering complex PCB solutions in a fast-paced

Qualifications

• BS in Electrical/Electronic Engineering or related field with 6+ years hardware experience.
• MS in Electrical/Electronic Engineering with 5+ years hardware experience.
• PhD in Electrical/Electronics Engineering with 4+ years hardware experience.

Responsibilities

• Design and layout PCBs for reference and high-volume DC, IoT, server, compute platforms.
• Engineer high-speed, multi-layer stack-ups for processors, RF, power delivery.
• Use advanced manufacturing techniques (stacked microvias, sequential lamination).
• Collaborate with US and global partners to deliver high-performance PCB solutions.
• Coordinate with stakeholders and suppliers for fabrication and assembly.

Skills

PCB high-speed design

Xpedition/Allegro

EMI mitigation

Cross-functional collaboration

Education

BS Electrical Engineering

MS Electrical Engineering

PhD in Electrical Engineering

Tools

Xpedition

Allegro

Mentor Graphics

CAM350

Valor

Job description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

Role / Skills / Experience

The successful candidate will operate as a member of the Central Hardware Systems Board design & layout team, and will be able to design and document printed circuit board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. You’ll collaborate with Data Center PDM, PM & Engineering teams to help design and implement schematics and constraints into high-quality PCB layouts for advanced breakouts + layout designs across Data Center, Server & Compute reference design form factor accurate platforms.

Key Responsibilities include:

• Design & Layout PCBs for reference & test DC, IOT, Server, Compute & 6G R&D systems, including form factor accurate (FFA) reference platforms and high-volume circuit boards.
• Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
• Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
• Collaborate effectively with internal teams in the U.S. and design partners globally to deliver high-performance PWB solutions.
• Liaise with internal stakeholders and external vendors to support HW platform & PCB fabrication and assembly throughout the product lifecycle.

The candidate is expected to have proficiency on Siemens/Mentor Xpedition, Altium or Cadence Allegro PCB design software and is expected to have experience in developing PCB design solutions for a variety of design types and working with internal teams and external suppliers to support PCB fabrication and assembly.

Minimum Requirements

• Experience using Xpedition or Allegro PCB design tools
• Familiar with COTS IOT Interfaces.
• Proficient with all MS Office 365 Tools.
• Understanding of how to use AI to efficiently solve problems.
• 12+ years actively involved in PCB high speed design.
• 12+ years actively involved in PCB design for HDI & high-density electronics packaging.
• 10+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Preferred Qualifications

• Experience as a Board design Engineer across HS layouts.
• Knowledge base of key component suppliers.
• BSEE with EE experience.
• Experience in Agile or similar PLM software.
• Proficient with all MS Office 365 Tools
• Understanding of how to use AI to efficiently solve problems.
• Design experience across RF, Analog, High-speed digital circuits – DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR board designs & stackups.
• Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards.
• Develops solutions to a variety of complex problems and proposes PCB design trade-offs to the PE team for resolution and implementation.
• Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s that meet schedule objectives.
• Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs
• Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors.
• Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
• Experience working with various EMI mitigation techniques and practices.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with HW leads, Engineering team & other internal PCB designers for optimal product development processes and schedule execution.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Prepare and deliver design reviews to project team.
• Possess excellent verbal and written communication skills
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members

Education Requirements

BS Electrical or Equivalent Engineering or equivalent work experience

Keywords:

PCB Design, HDI, DDR, LPDDR, IOT, Compute, Automotive, Smart Camera, Schematics, Board Layout, Allegro, Altium, Xpedition, Mentor Graphics

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Pay range and Other Compensation & Benefits : $169,800.00 - $254,600.00

We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .