Back End( BE) Process Integration Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 104,000 - 171,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plans

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon is seeking a College Grad to help define and optimize process flows for new technology nodes, spanning front-end and back-end operations.

You will coordinate across lithography, etch, deposition, diffusion, and metrology teams while driving RC performance enhancements and process window optimization. This role supports ramp from R&D to high-volume manufacturing with rigorous data analysis and SOP documentation.

Qualifications

• PhD in Electrical Engineering or related field.
• Hands-on cleanroom experience in interconnect process development and BEOL integration.
• Electrical characterization of interconnect stacks and reliability testing.

Responsibilities

• Develop and define integrated front-end and back-end process flows for new technology nodes.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
• Optimize RC (resistance-capacitance) performance.
• Establish process windows and integration schemes.
• Analyze yield loss and parametric failures.
• Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
• Drive corrective actions to improve yield and cycle time.
• Implement control plans and process monitoring strategies.
• Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis
• Ensure margins for electromigration, stress migration, TDDB, time dependent via degradation.
• Evaluate impact of process window shifts on reliability.
• Support ramp from R and D to high-volume manufacturing (HVM).
• Document process specifications and SOPs.

Skills

RC delay understanding

Electromigration

TDDB

Data analysis

Experiment design

Cross-functional collaboration

Communication

Education

PhD in Electrical Engineering or related field

Tools

JMP

Python

SQL

MATLAB

JSL

TCL

KLA tooling

Applied Materials tools

ALD

PECVD

CMP

Job description

As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The Intel Logic Technology development (LTD) organizations deliver process technology innovation to drive Intel's product roadmap.

Job Responsibilities

• Develop and define integrated front-end and back-end process flows for new technology nodes.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
• Optimize RC (resistance-capacitance) performance.
• Establish process windows and integration schemes.
• Analyze yield loss and parametric failures.
• Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
• Drive corrective actions to improve yield and cycle time.
• Implement control plans and process monitoring strategies.
• Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis
• Ensure margins for electromigration, stress migration, TDDB, time dependent via degradation.
• Evaluate impact of process window shifts on reliability.
• Support ramp from R and D to high-volume manufacturing (HVM).
• Document process specifications and standard operating procedures (SOPs).

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry-relevant job experience, internship experiences, and or schoolwork/classes/research.

Minimum Qualifications

• PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field of study.
• Hands-on cleanroom experience in one or more of the following: Interconnect process development (BEOL integration) Advanced interconnect metallization (Cu, Co, Ru, Mo, or emerging metals) Electrical characterization of interconnect stacks (RC, EM, reliability) Cleanroom process development in a university or industry fab environment.

Preferred Qualifications

Deep understanding of RC delay, electromigration, TDDB, via resistance, and low-k dielectric integration JMP, Python (scripting/automation), SQL, MATLAB, JSL, TCL — used for real data analysis, not just familiarity Hands-on experience with dry etch, ALD, PECVD, CMP, metallization in a research or production fab Demonstrated ability to design experiments, analyze results, and drive process improvements. Strong analytical and presentation skills — ability to translate complex data into actionable engineering decisions Familiarity with automation and defect classification systems (e.g., KLA, Applied Materials review tools). Proven ability to influence outcomes across engineering disciplines without direct authority. Clear, concise written and verbal communication of complex technical issues to diverse audiences. Track record of driving projects to completion with accountability in ambiguous, fast-moving environments.

Job Type

College Grad Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range

Annual Salary Range for jobs which could be performed in the US: $103,730.00-170,630.00 USD

Work Model

This role will require an on-site presence.

• Job posting details (such as work model, location or time type) are subject to change.
• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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