Audio Systems & Acoustics Engineering Intern

Skyworks; Hillsboro (OR); On-site; USD 36,000 - 65,000; Full time

Job summary

Skyworks Solutions in Hillsboro, Oregon, invites Engineering students to join as Audio Systems Engineering Summer Intern for Summer 2027. Work full-time onsite for three months (May–August 2027) in the SOC and systems applications teams, analyzing audio and acoustic systems and interfacing with chip/SOC, software, wireless, and AI groups.

You will gain hands-on experience with test equipment, Python/C/C++, DSP basics, and MS Office while contributing to the development of next-generation

Qualifications

• Must be enrolled in an engineering or science education program.
• Commitment to work onsite for 3 months (May/June - August 2027).
• Experience using test equipment such as oscilloscope, DMM, DC power supplies, etc.
• Ability to program in Python, C, C++
• Understanding of audio systems
• Knowledge of digital signal processing fundamentals
• Proficient in the use of MS Office (Excel and Word) and have an aptitude for quickly learning other company-specific software.
• Self-starter with a strong work ethic and love challenges. Ability to take ownership and ask for help when needed.
• Good communication, organization, and documentation skills

Responsibilities

• Analyze a variety of audio and acoustic systems within the SOC and systems applications teams.
• Interface with chip/SOC development, software development, wireless, and AI teams.
• Contribute to software and systems engineering efforts during the internship.

Skills

Python

C

C++

DSP fundamentals

MS Office

communication

Self-starter

Education

Enrolled in engineering or science program

Tools

Oscilloscope

DMM

DC Power Supplies

Test Equipment

Job description

Skyworks Solutions in Hillsboro, Oregon, invites Engineering students to join as Audio Systems Engineering Summer Intern for Summer 2027. Work full-time onsite for three months (May–August 2027) in the SOC and systems applications teams, analyzing audio and acoustic systems and interfacing with chip/SOC, software, wireless, and AI groups.

You will gain hands-on experience with test equipment, Python/C/C++, DSP basics, and MS Office while contributing to the development of next-generation