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Associate Research Scientist (PREP0003538)

The Johns Hopkins University

Gaithersburg (MD)

On-site

USD 86,000 - 95,000

Full time

2 days ago
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Job summary

The Johns Hopkins University seeks an Associate Research Scientist to conduct technical research related to reliability testing and failure analysis for semiconductor packaging. The role involves collaboration with NIST and requires a Ph.D. in a relevant field, with strong skills in polymer degradation and advanced materials characterization. The candidate will engage in experimental research aimed at understanding material reliability and failure mechanisms in CHIPS.

Qualifications

  • U.S. Citizen required.
  • Ph.D. in relevant fields required.
  • Experience in advanced semiconductor packaging preferred.

Responsibilities

  • Characterizing degradation of materials before, during, and after exposure.
  • Developing thermal conductivity protocols for samples used in CHIPS.
  • Conducting in-situ mechanical property measurements.

Skills

Strong oral and written communication skills
Reliability testing
Failure analysis
Polymer degradation
Thermal analysis
Microscopy techniques

Education

Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering / Physics / Chemical Engineering / Chemistry

Tools

X-ray scattering
Computed tomography
Nano- and micro-scale materials characterization

Job description

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Requisition #: A-169499-26

Status: Full Time

Type: Faculty

School: Whiting School of Engineering

Department/Program: Commercial and Government Programs Office

Salary: $86,000-$95,000 a year

Location City: Gaithersburg

Location State: MD

Location Zip Code: 20899

Closing Date: Open until filled

To apply: apply.interfolio.com/169499

General Description

PREP Research Associate

CHIPS Funded Project

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.

Research Title

Reliability Testing and Failure Analysis for Advanced Packaging of CHIPS

The Work Will Entail

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: polymer degradation, thermal and mechanical analysis, failure analysis using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization.

If selected, you will play a significant role in the projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long-term reliability of advanced packaging reliability and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.

Key Responsibilities Will Include But Are Not Limited To

  • Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
  • Developing thermal conductivity/thermal resistance and specific thermal analyzers for samples used in CHIPS advanced packaging.
  • Conducting in-situ mechanical property (elastic modulus, storage modulus, material creep, relaxation, adhesion) measurements at different temperatures
  • Developing test protocol for X-ray computed tomography for analysis of packaged samples before and after multi-stress testing
  • Developing microscopic and spectroscopic analytical methods for complex advanced packaging systems.
  • Developing robust datasets of materials and interface properties before and after aging for reliability models.
  • Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.

Qualifications

  • U.S. Citizen
  • Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering /Physics/Chemical Engineering/Chemistry
  • Strong oral and written communication skills
  • Experience in:
  • X-ray scattering or computed tomography
  • Nano- and micro-scale materials characterization
  • Degradation or failure analysis of polymeric materials
  • Experience in advanced semiconductor packaging is preferred

Application Instructions

Please Upload The Following With Your Application

  • CV/Resume
  • Please limit C.V to 3 pages only and ONLY include a valid email address for your contact info. Please DO NOT include telephone numbers, home address or photos on your resume.

Privacy Act Statement

Authority: 15 U.S.C.

  • 278g-1(e)(1) and (e)(3) and 15 U.S.C.
  • 272(b) and (c)

Purpose: The National Institute for Standards and Technology (NIST) hosts the Professional Research Experience Program (PREP) which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post-bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty.

PREP is a 5-year cooperative agreement between NIST laboratories and participating PREP Universities to establish a collaborative research relationship between NIST and U.S. institutions of higher education in the following disciplines including (but may not be limited to) biochemistry, biological sciences, chemistry, computer science, engineering, electronics, materials science, mathematics, nanoscale science, neutron science, physical science, physics, and statistics. This collection of information is needed to facilitate administrative functions of the PREP Program.

Routine Uses: NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to all the published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates.

Disclosure: Furnishing this information is voluntary. When you submit the form, you are indicating your voluntary consent for NIST to use of the information you submit for the purpose stated. By applying to a CHIPS-funded PREP opportunity, you also acknowledge that participation in the project requires signing a Non-Disclosure Agreement (NDA) prior to beginning any work.

To apply for this position, visit: apply.interfolio.com/169499

Salary Range

The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University's good faith belief at the time of posting. Not all candidates will be eligible for the upper end of the salary range. The actual compensation offered to the selected candidate may vary and will ultimately depend on multiple factors, which may include the successful candidate's geographic location, skills, work experience, internal equity, market conditions, education/training and other factors, as reasonably determined by the University.

Total Rewards

Johns Hopkins offers a total rewards package that supports our employees' health, life, career and retirement. More information can be found here: https://hr.jhu.edu/benefits-worklife/.

Equal Opportunity Employer

The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students. To that end, the university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristic. The university is committed to providing qualified individuals access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit without regard to personal factors that are irrelevant to the program involved.

Pre-Employment Information

If you are interested in applying for employment with The Johns Hopkins University and require special assistance or accommodation during any part of the pre-employment process, please contact the HR Business Services Office at jhurecruitment@jhu.edu. For TTY users, call via Maryland Relay or dial 711. For more information about workplace accommodations or accessibility at Johns Hopkins University, please visit accessibility.jhu.edu.

Background Checks

The successful candidate(s) for this position will be subject to a pre-employment background check including education verification.

EEO Is The Law

https://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf

Diversity and Inclusion

The Johns Hopkins University values diversity, equity and inclusion and advances these through our key strategic framework, the JHU Roadmap on Diversity and Inclusion.

Vaccine Requirements

Johns Hopkins University strongly encourages, but no longer requires, at least one dose of the COVID-19 vaccine. The COVID-19 vaccine does not apply to positions located in the State of Florida. We still require all faculty, staff, and students to receive the seasonal flu vaccine. Exceptions to the COVID and flu vaccine requirements may be provided to individuals for religious beliefs or medical reasons. Requests for an exception must be submitted to the JHU vaccination registry. This change does not apply to the School of Medicine (SOM). SOM hires must be fully vaccinated with an FDA COVID-19 vaccination and provide proof of vaccination status. For additional information, applicants for SOM positions should visit https://www.hopkinsmedicine.org/coronavirus/covid-19-vaccine/ and all other JHU applicants should visit https://covidinfo.jhu.edu/health-safety/covid-vaccination-information/.

The following additional provisions may apply, depending upon campus. Your recruiter will advise accordingly. The pre-employment physical for positions in clinical areas, laboratories, working with research subjects, or involving community contact requires documentation of immune status against Rubella (German measles), Rubeola (Measles), Mumps, Varicella (chickenpox), Hepatitis B and documentation of having received the Tdap (Tetanus, diphtheria, pertussis) vaccination. This may include documentation of having two (2) MMR vaccines; two (2) Varicella vaccines; or antibody status to these diseases from laboratory testing. Blood tests for immunities to these diseases are ordinarily included in the pre-employment physical exam except for those employees who provide results of blood tests or immunization documentation from their own health care providers. Any vaccinations required for these diseases will be given at no cost in our Occupational Health office.

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