Assembly Operator in Santa Clara

Energy Jobline ZR

Santa Clara (CA)

On-site

USD 34,000 - 44,000

Full time

14 days+
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Job summary

Energy Jobline ZR is seeking an Assembly Operator to perform semiconductor assembly processes including die attach, wire bonding, sealing, and related tasks to support high-reliability components. The role requires detailed work with accuracy, ability to operate manual and automated wire bonding equipment, and strong adherence to manufacturing procedures.

Training will cover visual inspection, burn-in, and testing.

Qualifications

  • Detailed assembly work with accuracy and consistency.
  • Die attach on various semiconductor packages.
  • Operate wire bonding equipment (semiconductor assembly experience).
  • Strong attention to detail and follow established manufacturing procedures.
  • Team player able to coordinate multiple assembly tasks.
  • Willing to learn additional manufacturing functions.

Responsibilities

  • Perform die attach of semiconductor dice to various packages.
  • Operate wire bonders to connect silicon dice to ceramic packages.
  • Clip devices with lids and perform device sealing.
  • Coordinate assembly tasks to support efficient production.
  • Receive training in additional manufacturing functions such as visual inspection, burn-in, and testing.
  • Perform other duties as assigned based on manufacturing needs.
  • Follow established procedures and maintain consistent quality throughout the assembly process.

Skills

Detailed assembly
Die attach
Wire bonding
Attention to detail
Teamwork
Willing to learn

Tools

Wire bonding equipment
Precision manufacturing equipment

Job description

Job DescriptionJob Description


About the job

The Assembly Operator performs semiconductor assembly processes including die attach, wire
bonding, sealing, and other manufacturing tasks to produce high-reliability semiconductor
components.


We're looking for someone who


  • Can perform detailed assembly work with accuracy and consistency

  • Can perform die attach on various semiconductor packages

  • Can operate manual and automated wire bonding equipment (semiconductor assembly experience)

  • Has strong attention to detail and can follow established manufacturing procedures

  • Can work effectively as part of a team and coordinate multiple assembly tasks

  • Is willing to learn and perform additional manufacturing functions as needed


What you'll do


  • Perform die attach of semiconductor dice to various packages

  • Operate manual and automated wire bonders to connect silicon dice to ceramic packages

  • Clip devices with lids and perform device sealing

  • Coordinate assembly tasks to support efficient production

  • Receive training in additional manufacturing functions such as visual inspection, burn-in, and testing

  • Perform other duties as assigned based on manufacturing needs

  • Follow established procedures and maintain consistent quality throughout the assembly process


Physical requirements


  • Must be able to stand and work at a production station for extended periods

  • Must be able to use hands and fingers for precise, repetitive assembly tasks

  • Must have the visual acuity and hand-eye coordination needed for detailed semiconductor assembly work

  • Must be able to work with small components and operate precision manufacturing equipment

  • Must be able to wear required personal protective equipment (PPE)

  • Must be able to occasionally lift and move materials or equipment as needed

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