ASIC Chip Lead

Broadcom Inc.

San Jose (CA)

On-site

USD 144,000 - 230,000

Full time

3 days ago
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Benefits offered by this job

Medical
dental and vision plans
401(K) participation including company
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
company paid holidays
paid sick leave and vacation time
Paid Family Leave and other leaves of

Job summary

Broadcom Inc. in San Jose, CA seeks a senior Physical Design Engineer to lead chip implementations across 40nm to 7nm nodes. You will perform floorplanning, clock-tree synthesis, and power integrity checks while coordinating with RTL, IP, and library teams to ensure robust design.

Responsibilities include IR drop analysis, ESD/padring considerations, and timing-closure methodologies. Proficiency with Innovus, Calibre, TCL scripting, and Python is preferred.

Qualifications

  • BS in Electrical Engineering with 12+ years of hands-on experience
  • MS in Electrical Engineering with 10+ years of experience
  • Multiple tapeouts experience
  • Extensive hands-on knowledge in Innovus, VCLP, Formality, LEC, timing closure, and Calibre
  • Cadence Innovus usage is essential
  • TCL scripting is required, Python is a plus

Responsibilities

  • Leading and implementing chips in various high-volume consumer devices to Satellite projects from ultra-low power 40nm nodes, 16nm to 7nm
  • Physical implementation of the blocks and top-level
  • Floorplanning including multi-power domain, PG planning, block-shaping & clock-tree implementation
  • Interfacing with internal and external teams, including Design, IPs, and Library Physical Verification for block and chip-level
  • Static and Dynamic IR drop Analysis
  • Signal and Power EM checks
  • Methodology & Flow development of Physical Design & Timing Closure
  • Working independently with the Synthesis & STA owners and RTL design team on Physical implementation and Power‑intent requirements
  • Knowledge of ESD, IO padring, Analog integration, and exposure to various types of packages, including flip‑chip, wlcsp is a plus
  • Knowledge of AI tools preferable

Skills

Tapeouts experience
Power integrity analysis
TCL scripting
Python

Education

BS in Electrical Engineering
MS in Electrical Engineering

Tools

Innovus
VCLP
Formality
LEC
Calibre
Cadence Innovus

Job description

Job Description
Responsibilities
  • Leading and implementing chips in various high-volume consumer devices to Satellite projects from ultra-low power 40nm nodes, 16nm to 7nm.
  • Physical implementation of the blocks and top-level.
  • Floorplanning including multi-power domain, PG planning, block-shaping & clock-tree implementation.
  • Interfacing with internal and external teams, including Design, IPs, and Library Physical Verification for block and chip-level.
  • Static and Dynamic IR drop Analysis.
  • Signal and Power EM checks.
  • Methodology & Flow development of Physical Design & Timing Closure.
  • Working independently with the Synthesis & STA owners and RTL design team on Physical implementation and Power‑intent requirements.
  • Knowledge of ESD, IO padring, Analog integration, and exposure to various types of packages, including flip‑chip, wlcsp is a plus.
  • Knowledge of AI tools preferable.
Qualifications
  • BS (Electrical)+ 12 years or MS (Electrical) +10 years of experience.
  • Multiple tapeouts experience and extensive hands‑on knowledge in various tools such as Innovus, VCLP, Formality, LEC, timing closure, and Calibre.
  • Cadence Innovus usage is essential.
  • TCL scripting is required, and Python is a plus.
Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Benefits
  • Medical
  • dental and vision plans
  • 401(K) participation including company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • company paid holidays
  • paid sick leave and vacation time
  • Paid Family Leave and other leaves of absence
Equal Opportunity

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

Additional Information

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series.

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