Application Solutions, Semiconductor Process and Device Simulations (TCAD)

Siemens EDA (Siemens Digital Industries Software); Cary (NC); Hybrid; USD 136,000 - 217,000; Full time

Benefits offered by this job

Incentive pay

Health benefits

Hybrid work

Job summary

Siemens EDA invites a researcher and application engineer to join the Calibre R&D Team. The role emphasizes physics-based modeling, device and process simulations, and collaboration across DTCO and metrology domains.

The candidate will contribute to high-fidelity modeling for advanced logic and memory nodes. Ideal applicants hold a PhD (or MS with significant experience) in electrical engineering or related fields, with expertise in fabrication, metrology, and device physics.

Qualifications

• PhD (or MS + 5+ years of research/industry experience) in Electrical Engineering, Applied Physics, or related field.
• Experience building physics-based models to solve real-world problems.
• Deep knowledge of semiconductor fabrication processes (plasma etch, CVD, PVD, CMP, Epitaxy, etc.).
• Experience in semiconductor metrology (optical or eBeam) and DTCO is a plus.

Responsibilities

• Collaborate with industry leaders to develop groundbreaking tools for advanced semiconductor manufacturing.
• Develop and optimize physics-based models and simulations for devices and processes.
• Contribute to DTCO efforts and device performance studies across logic and memory technologies.

Skills

Physics-based modeling

Semiconductor fabrication process

Semiconductor device & multi-physics

Semiconductor metrology

Strong problem-solving

Timeline estimation

Team collaboration

Education

PhD in Electrical Engineering

MS in Electrical Engineering + 5+ years experience

Job description

Siemens EDA is a global technology leader in Electronic Design Automation (EDA) software.

Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively.

Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Application Solutions, Semiconductor Process and Device Simulations

Join the Calibre™ R&D Team at Siemens EDA

We are seeking a highly motivated researcher and application engineer, preferably with expertise in semiconductor fabrication process (integration flow and key modules as sputter etch, chemical etch, CMP, deposition, Epitaxy, ion implantation, annealing, etc.), semiconductor metrology (optical or eBeam based), semiconductor devices physics, Design-Technology Co-optimization (DTCO).

About Us

The Calibre™ family of tools is the industry leader in EDA/CAD solutions for semiconductor manufacturing, enabling simulations and diagnostics from the transistor to the package level. As the semiconductor industry continues its rapid growth, there is a critical demand for high-fidelity modeling and high-throughput numerical simulations to support the production of stable, high-volume chips at advanced technology nodes.

In this pivotal role, you will collaborate with industry leaders to develop groundbreaking tools that accelerate semiconductor manufacturing and device performance study at the most advanced technologies (logic 2/1.4/1.0/0.7nm and beyond, 3D NAND, 6/4F2/3D DRAM, CIS, and 3DIC packaging). Our solutions will deliver significant performance gains over conventional approaches, essential for supporting high-volume manufacturing and the agile turnaround times our customers demand.

Qualifications

The ideal candidate should possess the following education and experience in one or more of following areas:

Education & Background

• PhD (or MS + 5+ years of research/industry experience) in Electrical Engineering, Applied Physics, or Other Engineering (Material Science, Mechanical, etc.), with expertise in:
• Physics-based Modeling Experience: has good intuitive to build physics-based models to solve real-world problems, capable to derive simplified models for complex systems.
• Semiconductor Fabrication Process: unit process modules such as plasma-based dry etch, wet etch/cleaning, CVD, PVD, ALD, CMP, Epitaxy, Ion Implantation, Annealing, etc. Integration flow for advanced logic transistors (FinFET, NSFET, CFET), DRAM (COB, vertical PassGates, 3D), 3D NAND and 3DIC (TSV, RDL), CIS, LED, etc.
• Semiconductor Device and Multi-Physics: semiconductor band-structure and carrier transport, reliability issues (BTI, TDDB, SHE, EM/IR drop), etc.
• Semiconductor Metrology: Optical (scatterometry, ellipsometry), eBeam (SEM) based.

Key Skills & Attributes

• Strong problem-solving skills with a passion for tackling complex application challenges.
• Ability to estimate application task complexity, timeline and deliver on schedule.
• Open and collaborative team mindset. Good communication skills.

Preferred US National Or Hybrid Mode

The salary range for this position is 135,800 to 217,300 and this role is eligible to earn incentive compensation. The actual compensation offered is based on the successful candidate's job-related skills, experience, and relevant education/training. Siemens offers health and wellness benefits to employees; you can access the benefits available in your country via the link:https://jobs.sw.siemens.com/benefits/

Working at Siemens Software Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.