Aerospace Electronics Packaging Mechanical Design Engineer

Moog; Buffalo (NY); Hybrid; USD 90,000 - 130,000; Full time

Benefits offered by this job

Bonus opportunities

401k matching

Relocation assistance

Comprehensive insurance

Job summary

Moog is seeking a Mechanical Design Engineer (Electronics Packaging) to join our hybrid team in the Buffalo-East Aurora area. You will develop and analyze the mechanical and thermal performance of flight hardware, review CAD concepts and ICDs, and contribute to proposal work while ensuring proper technical documentation.

The role emphasizes mechanical design with electronics packaging experience, GD&T proficiency, and exposure to FEA tools like ANSYS or NX for aerospace applications.

Qualifications

• Bachelor's degree in Mechanical Engineering from an accredited institution.
• Ability to access United States Export Controlled information.
• Minimum 3+ years of experience in mechanical design and analysis of complex mechanical systems.

Responsibilities

• Develop, qualify and transition to market best in class aviation electronics flight hardware.
• Design and analyze the structural and thermal performance of electronic systems.
• Participate in proposal development as a mechanical packaging expert, steering the mechanical design and thermal, vibration, and other environmental design philosophy.
• Develop and/or review design concepts, CAD models, ICDs, and assembly drawings.
• Ensure proper documentation of technical data for assigned projects in line with policies and procedures.
• Prepare data items for projects including thermal, vibration and mechanical tolerance analyses.

Skills

Mechanical design

Thermal analysis

Finite element analysis

GD&T

CAD drafting

Electronics packaging

Vibration analysis

Education

Bachelor's degree in Mechanical Engineering

Tools

Siemens NX

ANSYS

Job description

Moog is seeking a Mechanical Design Engineer (Electronics Packaging) to join our hybrid team in the Buffalo-East Aurora area. You will develop and analyze the mechanical and thermal performance of flight hardware, review CAD concepts and ICDs, and contribute to proposal work while ensuring proper technical documentation.

The role emphasizes mechanical design with electronics packaging experience, GD&T proficiency, and exposure to FEA tools like ANSYS or NX for aerospace applications.