Aerospace Electronics Packaging Design Engineer (Hybrid)

Moog Inc.; Buffalo (NY); Hybrid; USD 80,000 - 100,000; Full time

Benefits offered by this job

Bonus opportunities

401(k) matching

Employee Stock Purchase Plan

Flexible Spending Account

Job summary

Moog Inc. is hiring a Mechanical Design Engineer (Electronics Packaging) in a hybrid role based in Buffalo, NY. The engineer will design and analyze the structural and thermal performance of electronic systems and participate in proposal development, CAD modeling, and technical reviews.

Qualifications include a mechanical engineering degree, 3+ years in complex mechanical design, and experience with NX/ANSYS tools. Export-controlled information access is required.

Qualifications

• Bachelor’s degree in Mechanical Engineering from an accredited institution.
• Minimum 3+ years of experience in mechanical design and analysis of complex mechanical systems.
• Experience in aerospace/aviation environments is a plus.
• Proficiency in 3-D CAD modeling and drafting per industry standards.

Responsibilities

• Develop, qualify and transition to market best in class aviation electronics flight hardware.

Skills

Mechanical design

Thermal analysis

CAD drafting

GD&T Y14.5

FEA (ANSYS)

PCB/ electronics packaging

Vibration analysis

3D modeling (NX/UG)

Education

Bachelor’s degree in Mechanical Engineering

Tools

Siemens NX

ANSYS Workbench

ANSYS ICEPAK

ANSYS Sherlock

UG UniGraphics

Job description

Moog Inc. is hiring a Mechanical Design Engineer (Electronics Packaging) in a hybrid role based in Buffalo, NY. The engineer will design and analyze the structural and thermal performance of electronic systems and participate in proposal development, CAD modeling, and technical reviews.

Qualifications include a mechanical engineering degree, 3+ years in complex mechanical design, and experience with NX/ANSYS tools. Export-controlled information access is required.