Advanced Lead – SiC/GaN Power Module Packaging Engineer

Energy Consulting group; Pompano Beach (FL); On-site; USD 80,000 - 110,000; Full time

Job summary

An innovative firm in the aerospace sector is seeking a Power Module Packaging Engineer to design and optimize manufacturing processes for cutting-edge GaN and SiC power modules. This role involves collaboration with cross-functional teams to enhance production efficiency and ensure compliance with industry standards. The ideal candidate will possess a strong engineering background, particularly in semiconductor manufacturing, and demonstrate exceptional problem-solving and analytical skills. Join a dynamic team dedicated to advancing aviation technology and contribute to the development of high-performance power electronics.

Qualifications

• Master’s degree or higher in relevant engineering field is required.
• 3+ years of experience in semiconductor manufacturing focused on power modules.

Responsibilities

• Develop and optimize manufacturing processes for GaN and SiC power modules.
• Collaborate with design teams to ensure manufacturability and scalability.

Skills

Problem-solving skills

Analytical skills

Communication skills

Interpersonal skills

Education

Master’s degree in Electrical Engineering

PhD in related field

Tools

Simulation tools

Statistical process control (SPC)

Job description

Job Description Summary

At GE Aerospace, we are dedicated to pushing the boundaries of aviation technology and innovation. We are looking for passionate and talented individuals to join our team and contribute to our mission. If you are driven by excellence and eager to be part of a dynamic and forward-thinking organization, we invite you to explore the exciting opportunities we have to offer.

A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power density power electronics.

Job Description

The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing manufacturing processes for existing and new Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules. This individual will participate in power module design and simulation analyses, and will work closely with mechanical designers, quality, and production teams to ensure the efficient and reliable production of high-performance GaN and SiC power modules.

The engineer will also be involved in troubleshooting, process improvement, and ensuring compliance with industry standards and safety regulations.

Key Responsibilities:

Power Module Design and Simulation

• Collaborate with power module design team, provide insight on the developed module performance using simulation tools.
• Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs.

Process Development:

• Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing.

Process Optimization:

• Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production.
• Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance.

Quality Control:

• Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements.
• Conduct root cause analysis and implement corrective actions to address process-related quality issues.

Documentation and Reporting:

• Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs).
• Prepare technical reports and presentations to communicate process development and improvement activities.

Training and Support:

• Train production staff on new processes and equipment.
• Provide technical support to production teams to resolve process-related issues.

Safety and Compliance:

• Ensure all manufacturing processes comply with safety regulations and company policies.
• Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.

Qualifications:

• Master’s degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
• Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging.

Preferred Qualifications:

• PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
• Experience with GaN and SiC power module manufacturing and packaging technologies.
• Familiarity with industry standards and regulations related to power electronics.
• Strong knowledge of semiconductor fabrication processes, materials, and equipment.
• Excellent problem-solving and analytical skills.
• Strong communication and interpersonal skills.
• Ability to work collaboratively in a cross-functional team environment.